2010
DOI: 10.4209/aaqr.2009.10.0065
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Analysis of Relationship between Inorganic Gases and Fine Particles in Cleanroom Environment

Abstract: The concentrations and characteristics of major components in inorganic gases and fine particles were measured at the photo and etch cleanroom areas in a Taiwan semiconductor factory. The results showed that the major inorganic gases, as expressed in terms of volume concentration, were NH 3 and HF at 7-10 and 4-6 ppbv, respectively. The average PM 2.5 mass concentration were 17.52 and 18.23 μg/m 3 at the photo and etch areas, respectively, with species of Na + , NH 4 + , Cl -and SO 4 2-had the highest concentr… Show more

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Cited by 13 publications
(10 citation statements)
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“…Lastly, the performance of PAA and PI for the removal of ammonia was investigated under practical conditions using dynamic microbreakthrough measurements at 293 K. The experiments were performed under dry as well as humid (80% relative humidity (RH)) conditions to study the effect of water, which is typically detrimental to uptake capacities for materials with Lewis acidic sites. The partial pressure of ammonia in the feed stream (2000 mg/m 3 ) was approximately 2.8 mbar. Both materials exhibit steep breakthrough curves, indicating that the uptake process is not diffusion-controlled (Figure ).…”
Section: Resultsmentioning
confidence: 99%
“…Lastly, the performance of PAA and PI for the removal of ammonia was investigated under practical conditions using dynamic microbreakthrough measurements at 293 K. The experiments were performed under dry as well as humid (80% relative humidity (RH)) conditions to study the effect of water, which is typically detrimental to uptake capacities for materials with Lewis acidic sites. The partial pressure of ammonia in the feed stream (2000 mg/m 3 ) was approximately 2.8 mbar. Both materials exhibit steep breakthrough curves, indicating that the uptake process is not diffusion-controlled (Figure ).…”
Section: Resultsmentioning
confidence: 99%
“…The use of this coating material is well documented in previous research (Perrino, De Santis and Febo, 1990;Perrino and Gherardi, 1999;Wittmaack, 2006;Lin et al, 2010). However, the coating procedure was different in this study due to the special characteristic of the porous membrane denuder.…”
Section: Coatingmentioning
confidence: 74%
“…Detrimental effects caused by airborne molecular contaminates (AMCs) is a major concern in cleanroom air quality control, [1][2][3] particularly for a semiconductor fabrication cleanroom that follows stringent cleanroom requirements. The fabrication process is a multiplestep sequence of photo-lithographic (uses light to transfer patterns on a substrate's surface) and chemical processes, which gradually creates electronic circuits onto a wafer's (typically a silicon-based material) surface.…”
Section: Introductionmentioning
confidence: 99%