Analysis of packaged microwave integrated circuits by FDTD

Mezzanotte, P.; Mongiardo, M.; Roselli, L.; Sorrentino, R.; Heinrich, W.

doi:10.1109/22.310590

Cited by 27 publications

(5 citation statements)

References 32 publications

(6 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This way, for the case of conductors of finite extent, homogeneous-medium Green's functions are used in the integral representations of the potentials, as shown in the equations above. With these assumptions, inserting (2) and (3) into (1), and enforcing (1) at a point inside one of the conductors, we obtain an expression involving the unknown quantities and as follows: (4) where is the conductivity at the specific point inside the conductor. In order to solve the system of equations in (4), the current and charge densities are discretized into volume and surface cells, respectively.…”

Section: Development Of Peec Modelsmentioning

confidence: 99%

Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation

Pinello

Cangellaris

Ruehli

1997

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

The partial-element equivalent-circuit (PEEC) method is used to develop a flexible, hierarchical electromagnetic modeling and simulation environment for the analysis of noise generation and signal degradation mechanisms in packaged electronic components and systems. The circuitoriented approach used by the method for the development of the numerical approximation of the electric-field integral equation leads to SPICE-compatible, yet fully dynamic, discrete approximation of the electromagnetic problem. Contrary to other full-wave formulations, the proposed method has the important attribute of lending itself to a very systematic and physical model complexity reduction on the basis of the electrical size of the various portions of the system. Thus, a hybrid electromagnetic modeling and simulation environment is established for the analysis of complex structures which exhibit large variation in electrical size over their volume, using a combination of lumpedcircuit elements, transmission lines, as well as three-dimensional (3-D) distributed electromagnetic models. These models may or may not account for retardation, depending on the electrical size of the part of the structure that is being modeled. These special attributes of the proposed electromagnetic-simulation environment are demonstrated through several examples from its application to the modeling of noise interactions in generic interconnect and package geometries.

show abstract

Section: Development Of Peec Modelsmentioning

confidence: 99%

Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation

Pinello

Cangellaris

Ruehli

1997

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

show abstract

“…Let the transmission lines in Figure 1 have identical characteristics, and let Ff, be the reflection coefficient at the far-end wall and the propagation constant, respectively, corresponding to the dominant propagating mode. The source boundary reflection is minimized by using a matched source, wherein the circuit is excited in the source plane by a quasistatically computed transverse field distribution [20], and the source plane is replaced by Mur's ABC after the source waveform is established. Hence, the reflection from source-end boundary is not considered in the analysis.…”

Section: Discontinuity Characterizationmentioning

confidence: 99%

A study of the optimum compensation of open microstrip discontinuities using the FDTD method with boundary reflection error cancellation

Naishadham¹,

Lin²

1996

Int. J. Microw. Mill.‐Wave Comput.‐Aided Eng.

View full text Add to dashboard Cite

With the advances in computer technology, time-domain methods are being increasingly used in the electromagnetic simulation of complex microwave circuits and high-density packages. A major factor limiting the accuracy of direct Maxwell solvers such as the finite-difference time-domain (FDTD) method has been the reflection error introduced by lower-order absorbing boundary conditions such as Mur's. In this article, the dominant boundary reflection for open microstrip structures is canceled by appropriate superposition of subproblems with different boundary locations. The accuracy introduced by the new technique in the Yee FDTD implementation for microwave circuits is demonstrated by investigation of the microstrip bend compensation. It is shown that energy conservation is unconditionally fulfilled, and that the boundary can be brought closer to the circuit, resulting in computational savings as well. 0 1996 John Wiley & Sons, Inc.

show abstract

“…Possible solutions are to use the same perimeter, equal area, or simply taking the diameter as side length of the square. Although probably everyone involved in em simulations came across this problem once and via modeling has been treated in the literature quite frequently (see, e.g., [5][6][7][8][9]), nothing appears to have been published on this small but useful detail. This is presented in the following.…”

Section: Introductionmentioning

confidence: 99%

On the equivalence between cylindrical and rectangular via-holes in electromagnetic modeling

Buchta¹,

Heinrich

2007

2007 European Microwave Conference

View full text Add to dashboard Cite

In the em simulation of MMICs and packages it is often advantageous to use vias with rectangular cross-section instead of cicular ones, because this allows for more efficient meshing thus reducing numerical expense. This paper provides detailed results on how the dimensions should be chosen to achieve equivalent electrical behavior. The investigations show that, if the rectangular via is chosen properly, the deviations in electrical behavior compared to the cylindrical version remain very low over a broad bandwidth of frequencies.

show abstract

Analysis of packaged microwave integrated circuits by FDTD

Cited by 27 publications

References 32 publications

Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation

Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation

A study of the optimum compensation of open microstrip discontinuities using the FDTD method with boundary reflection error cancellation

On the equivalence between cylindrical and rectangular via-holes in electromagnetic modeling

Contact Info

Product

Resources

About