Analysis of package cracking during reflow soldering process

Kitano, Makoto; Nishimura, A.; Kawai, Sueo; Nishi, Kunihiko

doi:10.1109/relphy.1988.23432

Cited by 114 publications

(25 citation statements)

References 4 publications

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“…(2) with β and C, respectively we can obtain the hygroscopic stress Eqn. (6). The CME and C sat used for calculating hygroscopic stress in LED package are listed in Table III.…”

Section: Hygro-mechanical Modelingmentioning

confidence: 99%

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Mechanism and thermal effect of delamination in light-emitting diode packages

Yang

Shin

2007

Microelectronics Journal

116

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“…(2) with β and C, respectively we can obtain the hygroscopic stress Eqn. (6). The CME and C sat used for calculating hygroscopic stress in LED package are listed in Table III.…”

Section: Hygro-mechanical Modelingmentioning

confidence: 99%

“…All these contribute to the delaminations in LED packages. Delaminations are directly responsible for the lateral popcorn failure in reflow soldering process [6]. Delaminations in LED packages block the thermal pass.…”

Section: Introductionmentioning

confidence: 99%

Mechanism and thermal effect of delamination in light-emitting diode packages

Yang

Shin

2007

Microelectronics Journal

116

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“…Finally, it is assumed that the degree of moisture/reflow damage is controlled by the amount of moisture that accumulates at key internal interfaces. This interface concentration criterion has been successfully used and shown effective in several previous studies [6]- [8]. Due to the large flat geometric construction found in overmolded IC packages, the diffusional dependency for through-thickness diffusion can be treated as a simple one-dimensional problem.…”

Section: Theorymentioning

confidence: 99%

“…, e.g., the die/mold compound interface, and for a constant temperature and humidity environment, equation (6) reduces more simply to (7) Using (7), we now set about to determine the amount of moisture that accumulates at the buried internal interfaces during partial floor-life exposures and how this moisture re-distributes within the mold compound during storage containment.…”

Section: Formentioning

confidence: 99%

“…From this information, the critical interface concentration at the die surface is calculated to be mg/cm . Using the critical interface criterion [6]- [8], this amount is now considered the maximum moisture content at the die surface that can be tolerated in order to assure risk free assembly during solder reflow. Any moisture content above this concentration could potentially cause failures.…”

Section: A Dry Storagementioning

confidence: 99%

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Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Shook¹,

Goodelle²

2000

IEEE Trans. Electron. Packag. Manufact.

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Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMD's). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyzes coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMD's that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.

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Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules–Metal Composite Interface

Furuno

Takatuji

Kubo

et al. 2016

Elect Comm in Japan

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SUMMARY Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules–metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as adhesion promoter that shows greater adhesion between leadframe and epoxy resin. Also, the leadframe with adhesion promoter doesn't affect semiconductor assembly characteristics.

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Analysis of package cracking during reflow soldering process

Cited by 114 publications

References 4 publications

Mechanism and thermal effect of delamination in light-emitting diode packages

Mechanism and thermal effect of delamination in light-emitting diode packages

Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Improvement of the Adhesive Strength of the Leadframe and Epoxy Resin by Forming Organic Molecules–Metal Composite Interface

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