Analysis of no-clean flux spatter during the soldering process

Veselý, Petr; Busek, David; Krammer, Olivér; Dusek, Karel

doi:10.1016/j.jmatprotec.2019.116289

Cited by 25 publications

(7 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Reflow soldering leaves a minimal residue due to localized residue formation as compared with the wave soldering process (Wakeel et al , 2021). Veselý et al (2020) have highlighted the flux residue from solder paste during the reflow soldering and its effects on the solder joint quality. Therefore, the effect of flux residue becomes more important to be considered, especially for the miniaturization of electronic assembly.…”

Section: Resultsmentioning

confidence: 99%

Effect of alloy particle size and stencil aperture shape on solder printing quality

Sunar¹,

Bakar

Jalar

et al. 2022

View full text Add to dashboard Cite

Purpose Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area. Design/methodology/approach The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering. Findings The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints. Originality/value The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

show abstract

Section: Resultsmentioning

confidence: 99%

Effect of alloy particle size and stencil aperture shape on solder printing quality

Sunar¹,

Bakar

Jalar

et al. 2022

View full text Add to dashboard Cite

show abstract

“…The work by Piotrowska [32], which describes the liquid behavior on different surface morphologies, led us to this study. We used similar principles and built on different flux spreading on solder masks with different roughness [18]. The use of a glossy (white) mask led to a significant decrease in the spread area.…”

Section: Discussionmentioning

confidence: 99%

Section: Materials Effect On Imc Growthmentioning

confidence: 99%

“…The flux spread depends on surface tension vectors. The surface tension relationship to the spread area on the solder mask, including a detailed vector description and mutual relation is explained in reference [18] in detail and is shown in Figure 1. ) is the surface tension between solid and gas, σls (Nm −1 ) is the surface tension between liquid and solid, σlg (Nm −1 ) is the surface tension between liquid and gas.…”

Section: Materials Effect On Imc Growthmentioning

confidence: 99%

See 1 more Smart Citation

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

et al. 2021

Self Cite

View full text Add to dashboard Cite

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

show abstract

“…Usually, solder balling occurs in the preheating phase of the reflow profile, related to the excessive boiling of the flux and spattering (Briggs and Lasky, 2012). Veselý et al (2020) showed that higher surface roughness cause more prominent spreading and enhanced spattering. Arra et al (2002) showed that a nitrogen atmosphere and shorter ramp-up significantly reduce solder balling.…”

Section: Introductionmentioning

confidence: 99%

Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

Straubinger¹,

Tóth²,

Kerek

et al. 2022

SSMT

View full text Add to dashboard Cite

Purpose The purpose of this paper is to study the solder beading phenomenon (referring to larger-sized solder balls) of surface-mounted electrolytic capacitors. Solder beading could induce failures by violating the minimal electrical clearance on the printed circuit board (PCB). In modern lead-free reflow soldering, especially in high-reliability industries, such as automotive, aeroplane and aerospace, detecting and preventing such defects is essential in reliable and cost-effective manufacturing. Design/methodology/approach The large size of the involved components may block the view of automatic optical inspection; therefore, X-ray inspection is necessary. To detect the failure mode, X-ray imaging, cross-section grinding, optical microscopy and Fourier transformed infrared spectroscopy were used. High-resolution noncontact profilometry and optical microscopy were used to analyse component designs. The surface mounting process steps were also analysed to reveal their dependence on the issue. Test methods were designed and performed to reveal the behaviour of the solder paste (SP) during the reflow soldering process and to emphasise the component design relevance. Findings It was found that the reduction of SP volume only reduces the failure rate but does not solve the problem. Results show that excessive component placement pressure could induce solder beading. Statistical analysis revealed that differences between distinct components had the highest effect on the solder beading rate. Design aspects of solder beading-prone components were identified and discussed as the primary source of the problem. Practical implications The findings can be applied in surface-mount technology production, where the total failure count and resulting failure costs could be reduced according to the findings. Originality/value This paper shows that component design aspects such as the low distance between the underside of the component and the PCB and blocked proper outgassing of volatile compounds of the SP can be root causes of solder beading under surface-mounted electrolytic capacitors.

show abstract

Analysis of no-clean flux spatter during the soldering process

Cited by 25 publications

References 6 publications

Effect of alloy particle size and stencil aperture shape on solder printing quality

Effect of alloy particle size and stencil aperture shape on solder printing quality

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors

Contact Info

Product

Resources

About