2013
DOI: 10.1007/s12206-013-0425-z
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Analysis of melt-through process of 1.07 μm continuous wave high power laser irradiation on metal

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Cited by 5 publications
(4 citation statements)
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“…12 as a function of the beam radius and compared to data available in literature. 8,12 All values of a(r S ) lie within the reported lower and upper boundaries. We also observe that a(r S ) decreases with r S .…”
Section: Resultssupporting
confidence: 63%
See 1 more Smart Citation
“…12 as a function of the beam radius and compared to data available in literature. 8,12 All values of a(r S ) lie within the reported lower and upper boundaries. We also observe that a(r S ) decreases with r S .…”
Section: Resultssupporting
confidence: 63%
“…For a smooth iron or steel surface, the average normal emissivity in the bolometer's spectral range is 0.2 at room temperature and gradually increases with temperature up to 0.95 due to the growth of an oxide layer. 8,14,[24][25][26][27] A steep drop in the emissivity after the solidliquid phase transition 14,22 of the material therefore corresponds to a decrease of the measured bolometer temperature T BM . This allows the extraction of the melt time t M , the time at which the melt front reaches the back side of the plate.…”
Section: Resultsmentioning
confidence: 99%
“…The 3 meter high DN219 Thermal Energy Storage tank with its slenderness reflects the system that could potentially be installed in a mine shaft. The tank has a wall thickness of 3 mm and is made of stainless steel with a temperature dependent thermal conductivity of 14.1-18.3 W/mK [25]. Basalt grit with an average diameter of 15.5 mm was selected as the tank fill material.…”
Section: Methodsmentioning
confidence: 99%
“…The other effects begin at progressively higher energy thresholds that depend on the material. Thus, most studies on laser-material interactions have included the determination of these thresholds, and metallic materials have been actively researched, including theoretical and experimental investigations [7][8][9][10]. In crystalline materials such as silicon wafers, however, slip can occur before melting, which can easily lead to fracture of brittle materials even at temperatures below the melting point.…”
mentioning
confidence: 99%