Analysis of Internal Stress in a Tape Subsrate Made of the AISI 310S Stainless Steel for the Second-Generation HTS Wires Using Neutron Stress Diffractometry

Karpov, I. D.; Irodova, A. V.; Kruglov, V. S.; Shavkin, S. V.; Em, V. T.

doi:10.1134/s1063784220070063

Cited by 3 publications

(17 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…But the result, as it turned out, is not applicable to other tapes. In particular, in terms of the total balance of elastic forces, it does not agree with the data on the residual stress inside the AISI 310S tape with the same layer [6]. Obviously, in each HTS-2G wire, the residual stresses are individual, and they can be reliably determined only during the wire manufacturing process.…”

Section: Introductionmentioning

confidence: 70%

“…As samples the same tapes, on which neutron studies were carried out [5,6], were used to ensure the continuity of the results.…”

Section: Methodological Part 1samplesmentioning

confidence: 99%

“…The composition was determined as a result of X-ray microfluorescence analysis on Bruker AXS M4 TORNADO spectrometer by ten points uniformly distributed over the width of the tape at length of 10 mm; for light elements (C, Si, P and S) the data are taken from [15]. Absorption coefficients are calculated according to Tables [16]; the calculations used the density of a single crystal 8 mol.% Y 2 O 3 −ZrO 2 [17], which is close in composition to the YSZ layer, and the X-ray density of the tape AISI 310S with a 0 = 3.59 Å [6].…”

Section: Methodological Part 1samplesmentioning

confidence: 99%

“…Residual stresses inside the AISI 310S carrier tape at the initial stages of wire fabrication were measured using neutron stress diffractometry [5,6]. The stresses in the superconducting and buffer layers can only be determined by x-ray methods [7].…”

Section: Introductionmentioning

confidence: 99%

“…Previously [5,6] we measured the residual stresses inside the AISI 310S tape used as a carrier in the manufacture of HTS-2G wires at Research Center " Kurchatov Institute", from delivery to deposition of the main YSZ buffer layer inclusively. Here we present the results of X-ray diffraction study of residual stresses on the surface of this tape at the same stages of wire fabrication, as well as in the YSZ buffer layer itself.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Residual stresses at the interface between carrier tape and YSZ layer in manufacture of 2G HTS wires

et al. 2022

View full text Add to dashboard Cite

Using X-ray diffraction, there were determined the residual stresses on the surface of the AISI 310S stainless steel carrier tape used in manufacture of the second generation high temperature superconducting (2G HTS) wires at the National Research Center "Kurchatov Institute", from delivery to deposition of the main buffer layer YSZ between the tape and the superconducting layer, and the residual stress in the buffer layer YSZ itself. The compressive stress of -0.8 GPa induced by rolling was found on the surface of the tape as-delivered. During processing, it varies from -0.5 to -1.1 GPa. At each stage, its depth distribution was found down to 10 μm, and the residual stresses caused by processing were determined. The residual stress in the YSZ layer deposited using the ABAD technology is compressive and amounts to -3.29 GPa. The layer has a defective single-crystal structure in type to radiation swelling with the unstressed lattice period of 5.1820 Angstrem, 0.9% larger than in ordinary crystal. The results obtained are in agreement with the data of the earlier neutron diffraction study of residual stresses inside the carrier tape. Keywords: residual stress, 2G HTS wires, AISI 310S tape, YSZ layer, YSZ crystal structure, X-ray diffraction.

show abstract

Section: Introductionmentioning

confidence: 70%

“…As samples the same tapes, on which neutron studies were carried out [5,6], were used to ensure the continuity of the results.…”

Section: Methodological Part 1samplesmentioning

confidence: 99%

Section: Methodological Part 1samplesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Residual stresses at the interface between carrier tape and YSZ layer in manufacture of 2G HTS wires

et al. 2022

View full text Add to dashboard Cite

show abstract

Determination of Internal Strain and Residual Stress in Wires HTSC-2 Using Neutron Stress Diffractometry

Irodova,

Karpov,

Kruglov

et al. 2023

Phys. Atom. Nuclei

View full text Add to dashboard Cite

Residual stress in the carrier tape AISI 310S at the stage of deposition of the YSZ buffer layer when manufacturing of HTS-2G wire

et al. 2022

View full text Add to dashboard Cite

Using neutron diffraction we determined internal residual stress in the stainless steel AISI 310S carrier tape with a thickness of 100 μm and a width of 4 mm after mechanical polishing and the ABAD deposition of the textured YSZ buffer layer. It is shown that mechanical polishing causes a slight distension of the tape in the rolling plane. After the deposition of the YSZ layer, uniform tensile stress of 70 MPa isotropic in the rolling plane was observed inside the tape. Calculations have shown that it results from relaxation of compressive stress acting on the surface of the tape in a layer several times thicker than the YSZ layer. It is assumed that the surface of the tape is plastically deformed during the YSZ deposition. Keywords: residual stress, YSZ buffer layer, HTS-2G wire, AISI 310S carrier tape, neutron stress diffractometry.

show abstract

Analysis of Internal Stress in a Tape Subsrate Made of the AISI 310S Stainless Steel for the Second-Generation HTS Wires Using Neutron Stress Diffractometry

Cited by 3 publications

References 5 publications

Residual stresses at the interface between carrier tape and YSZ layer in manufacture of 2G HTS wires

Residual stresses at the interface between carrier tape and YSZ layer in manufacture of 2G HTS wires

Determination of Internal Strain and Residual Stress in Wires HTSC-2 Using Neutron Stress Diffractometry

Residual stress in the carrier tape AISI 310S at the stage of deposition of the YSZ buffer layer when manufacturing of HTS-2G wire

Contact Info

Product

Resources

About