Analysis of interconnect and package structures using PEEC models with radiated emissions

Pinello, W.; Ruehli, Albert E.; Cangellaris, A.C.

doi:10.1109/isemc.1997.667703

Cited by 7 publications

(4 citation statements)

References 13 publications

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“…3 is studied. Results relative to the input impedance in the range 1−10 GHz are available in the literature [9] and obtained by the standard PEEC method. The structure is modeled by assigning to each electrode a finite thickness of 10 −4 mm, while triangles on the surface have edges with average length of 1.4 mm.…”

Section: Accuracy Assessmentmentioning

confidence: 99%

Dual-PEEC Modeling of a Two-Port TEM Cell for VHF Applications

et al. 2011

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Section: Accuracy Assessmentmentioning

confidence: 99%

Dual-PEEC Modeling of a Two-Port TEM Cell for VHF Applications

et al. 2011

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“…3(b). In fact, the frequency-dependent term multiplying the mass matrix in (19) can be moved out of the assembly operator, and the series resistance and capacitance are then given by…”

Section: Spice-like Equivalent Circuitmentioning

confidence: 99%

Full-Wave Model of Frequency-Dispersive Media With Debye Dispersion Relation by Circuit-Oriented FEM

Maradei

Hubing

2009

IEEE Trans. Electromagn. Compat.

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Dispersive materials play an important role in a wide variety of applications (e.g., waveguides, antenna structures, integrated circuits, bioelectromagnetic applications). In this paper, a full-wave finite-element method (FEM-SPICE) technique for modeling dispersive materials is proposed. A finite-element formulation employing Whitney elements capable of analyzing electromagnetic geometries with dispersive media is described, and a Norton equivalent network is developed for each element. The overall network can be analyzed using a circuit simulator based on SPICE, and is suitable for both frequency- and time-domain analysis. This approach exploits the flexibility of finite-element mesh generation and computational efficiency of modern circuit simulators. Simple test configurations are analyzed to validate the proposed formulation

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“…The first systematic description of the PEEC goes back to the middle 1970s, in a work by Ruehli (1974). The original PEEC formulation is based on the discretization of EFIE equation (1) on a system of quadrilateral orthogonal cells defined on surfaces of conductors (Heeb and Ruehli, 1992;Pinello et al, 1997). Only recently (Freschi et al, 2005(Freschi et al, , 2006 PEEC method has been re-formulated by the light of the finite formulation of electromagnetic fields (FFEF), developed by Tonti (2002).…”

Section: Peec Formulationmentioning

confidence: 99%

Investigation of low‐frequency behaviour of two surface integral full‐Maxwell formulations

Freschi

Repetto

Gruosso

et al. 2007

COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering

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Purpose -To apply two different integral formulations of full-Maxwell's equations to the numerical study of interconnects in a low-frequency range and compare the results. Design/methodology/approach -The first approach consists of a surface formulation of the full-Maxwell's equations in terms of potentials, giving rise to a surface electric field integral equation. The equation, given in a weak form, is solved by using a finite element technique. The solenoidal and non-solenoidal components of the electric current density are separated using the null-pinv decomposition to avoid the low-frequency breakdown. The second model is an extension of partial element equivalent circuit technique to unstructured meshes allowing the use of triangular meshes. Two systems of meshes tied by duality relations are defined on multiconductor systems. The key point in the definition of the equivalent network is to associate the pair primal edge/dual face to a circuit branch. Solution of the resulting electrical network is performed by a modified nodal analysis method and regularization of the outcoming matrix is accomplished by standard techniques based on the addition of suitable resistors. Findings -Both the formulation have a regular behaviour at very low frequency. This is automatically achieved in the first approach by using the null-pinv decomposition. Research limitations/implications -Surface sources of fields. Originality/value -Two different integral formulations of full-Maxwell's equations for the numerical study of interconnects are compared in terms of low-frequency behaviour.

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Analysis of interconnect and package structures using PEEC models with radiated emissions

Cited by 7 publications

References 13 publications

Dual-PEEC Modeling of a Two-Port TEM Cell for VHF Applications

Dual-PEEC Modeling of a Two-Port TEM Cell for VHF Applications

Full-Wave Model of Frequency-Dispersive Media With Debye Dispersion Relation by Circuit-Oriented FEM

Investigation of low‐frequency behaviour of two surface integral full‐Maxwell formulations

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