2005
DOI: 10.1016/j.mseb.2005.05.018
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Analysis of I–V characteristics on Au/n-type GaAs Schottky structures in wide temperature range

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Cited by 83 publications
(46 citation statements)
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“…n is a measure of adherence to the pure thermionic emission theory as it reflects barrier deformation under bias [11]. The zero bias barrier height, is obtained from the reverse saturation leakage current (I S ):…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…n is a measure of adherence to the pure thermionic emission theory as it reflects barrier deformation under bias [11]. The zero bias barrier height, is obtained from the reverse saturation leakage current (I S ):…”
Section: Resultsmentioning
confidence: 99%
“…Several researchers have studied the electrical characteristics of Au/n-GaAs Schottky diodes and have reported a strong dependence of diode characteristics on temperature [4,7,8,[11][12][13]. Kim et al [14] studied the temperature dependence of Au/n-GaAs I-V characteristics using a semi analytical model in the 83 -323 K temperature range.…”
Section: Introductionmentioning
confidence: 99%
“…This feature indicates that the current transport behavior in p-GaP Schottky contacts cannot be explained by the ideal I-V method, namely the TE model, in which the SBHs and ideality factors should be independent of temperature. Such unusual behavior has often been found in III-V compound semiconductor-based Schottky diodes, 19,[23][24][25] since it is related to the barrier height inhomogeneity of contacts. 26 However, the I-V data points do not significantly deviate from linearity in the Richardson plot of ln(I 0 /T 2 ) versus 1000/T (dashed line, Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The ideality factor mentioned is estimated in the voltage range 0.032 to 0.524 V. Usually n = 1 for ideal diode, so the high value of ideality factor can be attributed to the effect of series resistance, voltage dependence of the BH and the voltage drop across the interfacial layer. Such type of interfacial layer is formed while fabricating the device by using conventional methods and before the process of the evaporation of the metals on the front surface of the n-type InGaN substrate [14][15][16].…”
Section: Results and Dicussionmentioning
confidence: 99%