2010 12th Electronics Packaging Technology Conference 2010
DOI: 10.1109/eptc.2010.5702620
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Analysis of electromigration for Cu pillar bump in flip chip package

Jae-Hyouk Yoo1,
Insoo Kang2,
Gi-Jo Jung3
et al.
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Cited by 12 publications
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References 4 publications
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Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

Syed
1
,
Karthikeyan
2
,
Moody
3
et al. 2011
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
29
1
11
0
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Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

Syed
1
,
Karthikeyan
2
,
Moody
3
et al. 2011
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
29
1
11
0
View full textAdd to dashboardCite

Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump

Orii
1
,
Toriyama
2
,
Kohara
3
et al. 2011
2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
14
0
3
0
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High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder

Khan
1
,
Kumbhat
2
,
Goyal
3
et al. 2012
2012 IEEE 62nd Electronic Components and Technology Conference
6
0
3
0
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