2004
DOI: 10.1023/b:ints.0000028655.11608.c7
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Analysis of Bulk and Interface Phenomena in CdTe/CdS Thin-Film Solar Cells

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Cited by 50 publications
(40 citation statements)
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“…However, the relative change in the diffusion profile and diffusion depth between the three samples is less than that observed in the window layer and considerably less than that observed in previous studies. 16,17 This is consistent with the minimal structural changes observed in the CdTe following activation. This also further emphasises the important role that even a gentle (low temperature) Cl-activation can have on the Cd 1Àx Zn x S alloy window layers investigated here.…”
Section: B Structural Changes In Devicessupporting
confidence: 87%
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“…However, the relative change in the diffusion profile and diffusion depth between the three samples is less than that observed in the window layer and considerably less than that observed in previous studies. 16,17 This is consistent with the minimal structural changes observed in the CdTe following activation. This also further emphasises the important role that even a gentle (low temperature) Cl-activation can have on the Cd 1Àx Zn x S alloy window layers investigated here.…”
Section: B Structural Changes In Devicessupporting
confidence: 87%
“…On the other hand, annealing appears to have led to some homogenisation of the Cd 1Àx Zn x S layer. The ability of CdCl 2 activation to enhance inter-diffusion has previously been reported 16,17 but in the case of S (from the CdS window layer) into CdTe, it is interesting to observe here the inter-diffusion effects in Cd 1Àx Zn x S alloy window layers.…”
Section: B Structural Changes In Devicesmentioning
confidence: 67%
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“…While the CdS/CdTe interface suffers from a 10% lattice mismatch that produces misfit dislocations, 57 CdTe absorber layers can be separated in two groups, depending on the substrate temperature used during the CdTe growth. For low-temperature processes (e.g., HVE) CdTe grows epitaxially on the CdS grains, with the {111} planes of CdTe being parallel to the {0001} planes of CdS.…”
Section: Cdtementioning
confidence: 99%
“…By varying the glancing angle of the FIB, it is also possible to profile the microstructure as a function of film thickness. FIB has also been used to examine grain boundary electrical behavior at specific sites using Electron Beam Induced Current (EBIC) measurements [2].In addition to grain boundary structure, EBSD provides information on orientation, grain size and shape, and phase distributions. Figure 2 shows a Local Orientation Spread Map with a bimodal grain size structure of small strained grains and larger strain free twinned grains from a partially recrystallized CdTe film.…”
mentioning
confidence: 99%