Analysis of a failure in a molded package caused by electrochemical migration

Dušek, Karel; Busek, David; Veselý, Petr; Placek, Martin; Reichl, Tomáš; Sedláček, Josef; Mach, Pavel

doi:10.1016/j.engfailanal.2020.105128

Cited by 7 publications

(6 citation statements)

References 24 publications

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Section: Damage By Thermal Stresssupporting

confidence: 90%

“…Lau et al [67] experimentally evaluated the characteristic lifetime of the rewiring layer and found that, at 0.0023 s after experiencing an impact, the maximum stresses of the package appeared in the four corners, with the bottommost rewiring layer undergoing the greatest stress and propensity to cracking. Similar stress distributions were also found in the study by Li et al [20] (Figure 10). In terms of external mechanical stress, Shih et al [69] found that when FCGBA assemblies are subjected to thermal cycling, the extra weight of the heat sink exerts additional mechanical stress on the solder joints, resulting in the solder balls at the corners of the uncovered FCBGA assemblies being more susceptible to more severe cracking.…”

Section: Damage By Thermal Stresssupporting

confidence: 90%

“…However, to understand the generation mechanism of such delamination failures, we need to consider two main scenarios: (1) moisture damage, i.e., delamination caused by the intrusion of moisture; and (2) thermal stress damage, i.e., delamination triggered by thermal stresses due to temperature changes. [20]. Copyright 2021, Elsevier.…”

Section: Delamination Mechanism At the Two-phase Interfacementioning

confidence: 99%

Section: Damage By Moisturementioning

confidence: 99%

Section: Figurementioning

confidence: 99%

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Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: Damage By Thermal Stresssupporting

confidence: 90%