Analysis and modeling of passive device degradation for a long-term electromagnetic emission study of a DC–DC converter

Huang, He; Boyer, Alexandre; Dhia, Sonia Ben

doi:10.1016/j.microrel.2015.06.058

Cited by 6 publications

(14 citation statements)

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“…This evolution is explained by a degradation of the organic binding material of the powder, which leads to an increase of core loss caused by the thermal stress [10]. As observed in [6], the degradation rate is more important at the lifetime beginning. The impact of thermal aging can be minimized if powder inductors without organic binder are used, such as the reference HC9-220.…”

Section: A Experimental Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…This work is an extension of [6], where the different devices that form a synchronous buck converter (capacitor, inductor, ferrite bead, diode, power MOSFET) are stressed thermally. Their impact on the evolution of EME is studied by simulation.…”

Section: Introductionmentioning

confidence: 99%

“…Their impact on the evolution of EME is studied by simulation. Besides, the study presented in [6] focuses only on the conducted emission (CE) at the output of the DC-DC converter. This work includes the measurement and the simulation of the CE at the input of the DC-DC converter.…”

Section: Introductionmentioning

confidence: 99%

“…As a result of the degradation of the electrolytic capacitors which are used to filter the output voltage of SMPS, an increase of ripple in the output voltage of SMPS was illustrated in [4] [5]. Another consequence is the increase of EME, as shown in [6], which is associated with the degradation of filtering passive devices.This work is an extension of [6], where the different devices that form a synchronous buck converter (capacitor, inductor, ferrite bead, diode, power MOSFET) are stressed thermally. Their impact on the evolution of EME is studied by simulation.…”

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confidence: 99%

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Study of the thermal aging effect on the conducted emission of a synchronous buck converter

Boyer

Sentis

Ghfiri

et al. 2017

2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE

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Abstract-This paper studies the impact of the accelerated thermal aging on the conducted emission produced by a synchronous buck converter. The most degraded devices mounted on the DC-DC converter are identified and modeled in order to simulate the evolution of conducted emission and anticipate risks of non-compliance to emission requirements.Keywords-DC-DC converter; electromagnetic emission; accelerated aging; degradation modeling I. INTRODUCTIONBecause of their high power efficiency, switch-mode power supplies (SMPS) are widely used in electronic applications [1]. However, one main drawback of SMPS is the noise produced by the switching activity, responsible for conducted and radiated electromagnetic emission (EME). Therefore, the management of the parasitic emission of SMPS is a frequent topic in the literature on electromagnetic compatibility (EMC). Numerous papers dealt with the origin and the modeling of EME, and also the development of design guidelines to improve these issues [2] [3]. Several recent studies presented the long-term behavior of SMPS. As a result of the degradation of the electrolytic capacitors which are used to filter the output voltage of SMPS, an increase of ripple in the output voltage of SMPS was illustrated in [4] [5]. Another consequence is the increase of EME, as shown in [6], which is associated with the degradation of filtering passive devices.This work is an extension of [6], where the different devices that form a synchronous buck converter (capacitor, inductor, ferrite bead, diode, power MOSFET) are stressed thermally. Their impact on the evolution of EME is studied by simulation. Besides, the study presented in [6] focuses only on the conducted emission (CE) at the output of the DC-DC converter. This work includes the measurement and the simulation of the CE at the input of the DC-DC converter. the paper is organized as follows: the first section describes the studied DC-DC converter, the tested devices and the accelerated aging method. The second section presents the experimental results of characterization of stressed devices and their modeling. In the last section, the model of stressed devices are used to simulate the effect of thermal aging on the CE produced by the DC-DC converter. The influence of aging of different filtering passive devices is compared. II. PRESENTATION OF THE CASE STUDY A. Description of the DC-DC converterThe studied synchronous buck converter is mounted on a 55x58 mm four-layer board. This type of circuit is one of the major contributor of conducted and radiated emission in electronic systems. A simplified schematic of the converter is presented in Fig. 1. It is based on the LT3800 controller from Linear Technology, configured in step-down operation to convert the 12 V voltage provided by a battery into a 5 V regulated voltage for a maximum current of 10 A. This circuit drives the gates of two power NMOSFET (Q1, Q2) mounted in D 2 PAK package. A Schottky diode (D) is mounted in parallel to Q2. The switching frequency is set to 200 KHz. An external...

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Section: A Experimental Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

See 3 more Smart Citations

Study of the thermal aging effect on the conducted emission of a synchronous buck converter

Boyer

Sentis

Ghfiri

et al. 2017

2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE

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Fault diagnosis in switched‐linear systems by emulation of behavioral models on FPGA: A case study of current‐mode buck converter

Bhattacharya

Kumar

Biswas

2017

Int J Numerical Modelling

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This paper presents an Field‐Programmable Gate Array (FPGA)‐based fault emulation and detection framework for switched‐linear systems commonly encountered in power electronics. The proposed framework exploits high‐level behavioral modeling that maps analog functionality into fixed‐point architectures supported by FPGAs. This work is mainly concerned with modeling and validation of effectiveness of a fault diagnoser of a power converter much before its fabrication. The proposed concept of fault diagnosis at presilicon stage overcomes several reliability issues in power electronic systems and enables design and development of test resources, verification of test bed, and interconnecting circuitry at an early stage of the design. To illustrate applicability of this environment, well‐accepted fault events including hard and soft faults are emulated with the help of a nonideal model of a buck converter and a piecewise linear detection filter, which follow an observer‐based residual generation for fault detection. The paper also shows that the proposed method is equally applicable for detection of faults under unstable operation of the converter. The effectiveness of the proposed framework is evaluated through FPGA‐based simulation (or “emulation”) of a peak‐current‐mode–controlled buck‐type switching converter implemented on Xilinx Kintex‐7 FPGA in MATLAB/Simulink environment with Xilinx System Generator support. To the best of our knowledge, fault diagnosis in power converter by emulation of its nonideal model on FPGA is attempted for the first time in the literature. Experimental results show that power converter faults can be easily detected by monitoring detection filter residuals while some of the faults can be precisely identified.

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Study of the thermal aging effect on the conducted emission of a synchronous buck converter

Boyer

Sentis

Ghfiri

et al. 2017

2017 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo)

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Analysis and modeling of passive device degradation for a long-term electromagnetic emission study of a DC–DC converter

Cited by 6 publications

References 5 publications

Study of the thermal aging effect on the conducted emission of a synchronous buck converter

Study of the thermal aging effect on the conducted emission of a synchronous buck converter

Fault diagnosis in switched‐linear systems by emulation of behavioral models on FPGA: A case study of current‐mode buck converter

Study of the thermal aging effect on the conducted emission of a synchronous buck converter

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