Analysis and Comparison of Readout Architectures and Analog-to-Digital Converters for 3D-Stacked CMOS Image Sensors

Callens, Nicolas; Gielen, Georges

doi:10.1109/tcsi.2021.3085027

Cited by 11 publications

(3 citation statements)

References 55 publications

(89 reference statements)

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“…However, the power consumption is larger than other works, mainly because of the use of folded-cascoded amplifiers. Since the ADC area is important in image sensors, especially for 3D-stacked image sensors, an area-scaled figure of merit is defined as [18]:…”

Section: Resultsmentioning

confidence: 99%

A Compact Adderless Feed-Forward Incremental Delta Sigma with Multiple Global References for CMOS Image Sensors

Callens

Gielen

2022

Preprint

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This paper presents an adderless feed-forward incremental ΔΣ (IΔΣ) with asynchronous SAR (ASAR) that removes the need for in-column calibration by using global references, eliminates an additional summing amplifier and reduces the conversion time by using a multi-bit ASAR quantizer. The proposed IΔΣ ADC is designed in 40nm CMOS technology and is laid out compactly in a 5 μm x 466 μm column. According to post-layout simulations, the ADC achieves an input-referred noise of 85 μVrms, a conversion time of 3.2 μs (with DCDS) and a power consumption of 230 μW. This results in a Walden FoMW of 234 fJ/conv.step and a FoMA = FoMW x AADC of 0.54 fJ.mm2/conv.step, which demonstrates the feasibility of using the proposed architecture in CMOS image sensors.

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Section: Resultsmentioning

confidence: 99%

A Compact Adderless Feed-Forward Incremental Delta Sigma with Multiple Global References for CMOS Image Sensors

Callens

Gielen

2022

Preprint

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“…An image sensor used in this study was composed of a multi-grid pixel array, and each pixel contained a CMOS (complementary metal-oxide semiconductor) and a PD (photo detector) [ 20 ]. CMOS image sensors always integrate analog front end (AFE) circuits because this can achieve the properties of reduced cost, fast response, and low power consumption [ 21 ]. As shown in Figure 1 , when the shutter was activated, the photodetector received the light signal and converted it into an electrical signal.…”

Section: Methodsmentioning

confidence: 99%

Research and Evaluation on an Optical Automatic Detection System for the Defects of the Manufactured Paper Cups

Wang

Lee

Tseng

et al. 2023

Sensors

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In this paper, the paper cups were used as the research objects, and the machine vision detection technology was combined with different image processing techniques to investigate a non-contact optical automatic detection system to identify the defects of the manufactured paper cups. The combined ring light was used as the light source, an infrared (IR) LED matrix panel was used to provide the IR light to constantly highlight the outer edges of the detected objects, and a multi-grid pixel array was used as the image sensor. The image processing techniques, including the Gaussian filter, Sobel operator, Binarization process, and connected component, were used to enhance the inspection and recognition of the defects existing in the produced paper cups. There were three different detection processes for paper cups, which were divided into internal, external, and bottom image acquisition processes. The present study demonstrated that all the detection processes could clearly detect the surface defect features of the manufactured paper cups, such as dirt, burrs, holes, and uneven thickness. Our study also revealed that the average time for the investigated Automatic Optical Detection to detect the defects on the paper cups was only 0.3 s.

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“…The setup consisted of two inspection stations: the first statio used for internal image inspection using a combined ring light source, while the s An image sensor comprises a pixel array with multiple grids where a pixel is formed through combining a complementary metal-oxide semiconductor (CMOS) and a photo detector (PD) [15]. To achieve reduced cost, fast response, and low power consumption, a CMOS image sensor always integrates an analog front-end circuit [16]. Combining a ring light source offers many advantages such as long lifetime and good uniformity, and it can highlight the details of an object's surface while reducing the reflective effect via adding a reflective light guide plate [17].…”

Section: System Architecturementioning

confidence: 99%

Method and Installation for Efficient Automatic Defect Inspection of Manufactured Paper Bowls

Lee

Chen

et al. 2023

Photonics

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Various techniques were combined to optimize an optical inspection system designed to automatically inspect defects in manufactured paper bowls. A self-assembled system was utilized to capture images of defects on the bowls. The system employed an image sensor with a multi-pixel array that combined a complementary metal-oxide semiconductor and a photo detector. A combined ring light served as the light source, while an infrared (IR) LED matrix panel was used to provide constant IR light to highlight the outer edges of the objects being inspected. The techniques employed in this study to enhance defect inspections on produced paper bowls included Gaussian filtering, Sobel operators, binarization, and connected components. Captured images were processed using these technologies. Once the non-contact inspection system’s machine vision method was completed, defects on the produced paper bowls were inspected using the system developed in this study. Three inspection methods were used in this study: internal inspection, external inspection, and bottom inspection. All three methods were able to inspect surface features of produced paper bowls, including dirt, burrs, holes, and uneven thickness. The results of our study showed that the average time required for machine vision inspections of each paper bowl was significantly less than the time required for manual inspection. Therefore, the investigated machine vision system is an efficient method for inspecting defects in fabricated paper bowls.

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Analysis and Comparison of Readout Architectures and Analog-to-Digital Converters for 3D-Stacked CMOS Image Sensors

Cited by 11 publications

References 55 publications

A Compact Adderless Feed-Forward Incremental Delta Sigma with Multiple Global References for CMOS Image Sensors

A Compact Adderless Feed-Forward Incremental Delta Sigma with Multiple Global References for CMOS Image Sensors

Research and Evaluation on an Optical Automatic Detection System for the Defects of the Manufactured Paper Cups

Method and Installation for Efficient Automatic Defect Inspection of Manufactured Paper Bowls

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