An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene

Selbmann, Franz; Roscher, Frank; Tortato, Felipe de Souza; Wiemer, Maik; Otto, Thomas; Joseph, Yvonne

doi:10.1109/ssi52265.2021.9466996

Cited by 6 publications

(6 citation statements)

References 8 publications

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“…Aside from the novelty of the method for the integration itself, this transfer technology overcomes the limitations of ultra-thin, flexible and temperature-sensitive materials that impede the usage of established integration technologies, such as wire bonding, soldering or printing, and dispensing, respectively. Hence, it closes an open research gap for the integration of dies and components on flexible substrates, such as the ultra-thin flexible Parylene PCB [ 11 ]. Additionally, the described new transfer process can be an alternative to fan-out wafer packaging [ 31 ].…”

Section: Discussionmentioning

confidence: 99%

“…When using flexible substrates, the typical materials are polymers, such as polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polyimide (PI), polycarbonate (PC), polyethersulphone (PES), polyacrylates (PAR), polycyclic olefin (PCO) and poly(para-xylylene) (Parylene). [ 8 , 9 , 10 , 11 , 12 , 13 ] In contrast to the other materials, Parylene can be particularly used to realize an ultra-thin and biocompatible flexible PCB with thicknesses of only 10 µm–20 µm. This includes multiple redistribution layers, which are fabricated by using established microsystem technologies and, hence, feature structure sizes as small as 10 µm [ 11 ].…”

Section: Introductionmentioning

confidence: 99%

“…[ 8 , 9 , 10 , 11 , 12 , 13 ] In contrast to the other materials, Parylene can be particularly used to realize an ultra-thin and biocompatible flexible PCB with thicknesses of only 10 µm–20 µm. This includes multiple redistribution layers, which are fabricated by using established microsystem technologies and, hence, feature structure sizes as small as 10 µm [ 11 ].…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, most of the established standard packaging methods, such as soldering or bonding, can only be applied to flexible substrates, but with limitations due to inappropriate process conditions, particularly high temperatures. Particularly, the application of standard packaging and integration methods is not possible for the established ultra-thin Parylene flexible PCB [ 11 ].…”

Section: Introductionmentioning

confidence: 99%

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Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

et al. 2023

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Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, established technologies for the fabrication of sensors and actuators, as well as the related packaging, are based on rigid substrates, i.e., silicon wafer substrates and printed circuit boards (PCB). Moreover, most of the flexible substrates investigated until now are not compatible with the aforementioned fabrication technologies on wafers due to their lack of chemical inertness and handling issues. In this presented paper, we demonstrate a conceptually new approach to transfer structures, dies, and electronic components to a flexible substrate by lift-off. The structures to be transferred, including the related electrical contacts and packaging, are fabricated on a rigid carrier substrate, coated with the flexible substrate and finally lifted off from the carrier. The benefits of this approach are the combined advantages of using established semiconductor and microsystem fabrication technologies as well as packaging technologies, such as high precision and miniaturization, as well as a variety of available materials and processes together with those of flexible substrates, such as a geometry adaptivity, lightweight structures and low costs.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

et al. 2023

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“…However, in the last years, new applications in the field of MEMS also have been established using Parylene as a functional or structural material, e.g., as an adhesive for wafer and chip bonding [ 1 , 12 , 13 ]. MEMS using Parylene include not only acceleration sensors [ 14 ], pressure and force sensors [ 15 , 16 ], acoustics [ 17 , 18 ], optical devices [ 19 , 20 ], microfluidics [ 21 , 22 ], and lab on chip [ 23 ], but also its use as a substrate material for flexible electronics [ 24 , 25 ]. The increased usage of Parylene for the various applications raises the question regarding the reliability and lifetime of Parylene, i.e., any impacts of aging on its properties.…”

Section: Introductionmentioning

confidence: 99%

Impact of Non-Accelerated Aging on the Properties of Parylene C

et al. 2022

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The polymer Parylene combines a variety of excellent properties and, hence, is an object of intensive research for packaging applications, such as the direct encapsulation of medical implants. Moreover, in the past years, an increasing interest for establishing new applications for Parylene is observed. These include the usage of Parylene as a flexible substrate, a dielectric, or a material for MEMS, e.g., a bonding adhesive. The increasing importance of Parylene raises questions regarding the long-term reliability and aging of Parylene as well as the impact of the aging on the Parylene properties. Within this paper, we present the first investigations on non-accelerated Parylene C aging for a period of about five years. Doing so, free-standing Parylene membranes were fabricated to investigate the barrier properties, the chemical stability, as well as the optical properties of Parylene in dependence on different post-treatments to the polymer. These properties were found to be excellent and with only a minor age-related impact. Additionally, the mechanical properties, i.e., the Young’s modulus and the hardness, were investigated via nano-indentation over the same period of time. For both mechanical properties only, minor changes were observed. The results prove that Parylene C is a highly reliable polymer for applications that needs a high long-term stability.

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Functional materials for powering and implementing next-generation miniature sensors

Wu,

Ouro-Koura,

et al. 2023

Materials Today

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An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene

Cited by 6 publications

References 8 publications

Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates

Impact of Non-Accelerated Aging on the Properties of Parylene C

Functional materials for powering and implementing next-generation miniature sensors

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