An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

Chang, D.D.; Crawford, P.A.; Fulton, J.A.; McBride, R.; Schmidt, M.; Sinitski, R.E.; Wong, Ching‐Ping

doi:10.1109/33.273681

Cited by 64 publications

(12 citation statements)

References 2 publications

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“…1 Anisotropic conductive adhesive film (ACF) is one of the promising materials for the near future for such application. 2 In fact, conductive adhesive joining technology has been used for many years in the area of hybrid technology, liquid-crystal display interconnect, and chip-on-glass technology. It is only recently that efforts have been made to develop new conductive adhesives for surface mount and low-cost, flip-chip electronics, volume manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Curing kinetics of anisotropic conductive adhesive film

Chan

Uddin

Alam

et al. 2003

Journal of Elec Materi

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Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications, such as chip-on-glass, chip-on-flex, etc. Among all the conductive-adhesive materials, anisotropic conductive adhesive film (ACF) is an attractive interconnect material because of its fine pitch capability. Anisotropic conductive-adhesive film is a thermosetting, epoxy matrix impregnated with a small amount of electrically conductive particles. During component assembly, the epoxy resin is cured to provide mechanical connection, and the conducting medium provides electrical connection in the z direction. The thermal cure process is critical to develop the ultimate electrical and mechanical properties of the ACF. In this paper, the curing reaction of ACF was studied with a differential scanning calorimeter (DSC) under isothermal conditions in the range of 120-180°C. An autocatalyzed kinetic model was used to describe the curing reaction. The rate constant and the reaction orders were determined and used to predict the progress of the curing reaction. A good agreement is found between the proposed kinetic model and the experimental reaction-rate data. The reaction-rate constants were correlated with the isothermal temperature by the Arrhenius equation. The glass-transition temperature also has been studied as a function of cure degree and moisture absorption.

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Section: Introductionmentioning

confidence: 99%

Curing kinetics of anisotropic conductive adhesive film

Chan

Uddin

Alam

et al. 2003

Journal of Elec Materi

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“…In the FPD system, the technology for the electronic packaging of many closely spaced electrodes at one time has been indispensable. To achieve this purpose, two technologies using anisotropic conductive films (ACFs) have been widely adopted [1,2]. These are the tape-automated bonding (TAB) technology for larger displays size -10" and the chip-on-glass (COG) technology for smaller than ~10".…”

Section: Introductionmentioning

confidence: 99%

“…Along with the massive production of liquid crystal display (LCD) especially, anisotropic conductive films (ACFs) are being accepted by industry as the best materials for the electronic packaging of FPD. Furthermore, because of the reliable performance and uncomplicated process, the attempt to apply ACFs all such semiconductor packages as chip size packaging (CSP) is still growing [2][3][4].…”

Section: Introductionmentioning

confidence: 99%

Stiffness effect of conductive composite powder on electrical properties of ACF for FPD

Kim

Moon

Choi

et al. 1999

Metals and Materials

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Elastic moduli of C/Ps were varied to develop an epoxy-based reparable thermosetting ACF for FPD without causing bounce-up in the contact resistance and fracture of the conductive composite powders (C/Ps). The modification of the elastic properties of the C/Ps was done by modulating of the elastic properties of the Polystyrene (PS) bead that is the core of the C/P. The elastic properties of the PS bead changed by crosslinking degree during seeded emulsion polymerization. A simulation based on the experimental results was done to find the optimum mechanical properties of C/Ps for future f'mer pitch size application. For better simulation, both cases (with/without consideration of interfacial friction and slip) were compared. From these experiments, the following results were confirmed. C/P stiffness was controlled by a change of cross-linking density of the PS bead. The mechanical behaviors between the C/P and PS bead were similar within error range. When the cross-linking density of the C/P was less than 50%, the C/P could be deformed over 40% without fracture. Also, the ACF with a 50% cross-linking density C/P didnt show any bounce-up in C/Ps contact resistance and fracture. Although differences between the cases (with and without consideration of interfacial friction and slip) were observed, neither case matched the experimental result. For a closer simulation, a variation in frictional coefficient is needed.

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“…This choice is due to its steady and low resistivity (1.6 μΩ cm [15]), its good capability of current carrying and its chemical stability. The negative issue is the possible occurrence of the electromigration phenomenon [16]. The volume fraction of filler, till today to 70-80%, plays a fundamental role in the mechanism of electrical conduction: if high, the probability of a conductive path formation, between the various particles drowned in the matrix of epoxy resin, is greater (conductive chain), on the other side it is also true that at the same time the viscosity of the conductive resin increases making more difficult its use and workability.…”

Section: Electrically Conductive Adhesivementioning

confidence: 99%

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

Catelani

Scarano

Berni

2013

Int. J. Metrol. Qual. Eng.

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Abstract. Understanding the ageing of materials for electronic application is a complex challenge, in particular for composite material as electrically conductive adhesive consisting of a nonconductive polymer binder and conductive filler particles. This research involves a large amount of parameters related to both operating conditions and material structure, which act together. Accelerated testing, with the aim to consume rapidly lifetime without inducing incorrect failure mechanisms, is difficult to optimize and its modelling to describe the ageing process is a challenge. To reach this aim could be interesting for the characterization of the material but above all for the general validity of the proposed methodology.

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An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

Cited by 64 publications

References 2 publications

Curing kinetics of anisotropic conductive adhesive film

Curing kinetics of anisotropic conductive adhesive film

Stiffness effect of conductive composite powder on electrical properties of ACF for FPD

Optimization of accelerated testing through design of experiment for ageing of lead-free electronic interconnection material

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