An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer

Zhang, Jian; Luo, Guoqiang; Wang, Yiyu; Shen, Qiang

doi:10.1016/j.matlet.2012.06.014

Cited by 96 publications

(32 citation statements)

References 20 publications

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“…Generally, an applied pressure less than 10 MPa was enough for diffusion bonding of crystalline metals [26][27][28], while 150 MPa was necessary for diffusion bonding of one BMG to another BMG [21,29]. In this study the pressure of 70 MPa and 90 MPa, the intermediate value for diffusion bonding of BMG and crystalline metals, were adopted in the experiments.…”

Section: Methodsmentioning

confidence: 99%

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

et al. 2015

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Section: Methodsmentioning

confidence: 99%

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

et al. 2015

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“…Ni interlayer was also used to join the dissimilar set up of magnesium to aluminum. It was reported that a reaction layer between the two dissimilar materials was formed based on Mg 2 Ni, where the fracture occurred within this layer [13].…”

Section: Introductionmentioning

confidence: 99%

Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers

Alhazaa

Shar

Atieh

et al. 2018

Metals

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Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu coatings with Sn interlayer. Copper coatings were used for one set of the bonds, and a combination of Cu coatings and Sn interlayer was used for the other set of bonds. The bonding temperature was fixed at 520 • C, and various bonding times were applied. This study shows that the bonds produced using only Cu coatings have shown weaker bonds compared to the bonds made using Cu coatings and Sn interlayer. The Cu 2 Mg particles were detected at the joint region of both bonds made by Cu coatings and Cu coatings with Sn interlayer by X-ray diffraction (XRD). However, it has been observed that the joint region was dominated by solid solution which is rich in Mg. Sn interlayer was not contributed to the intermetallic compound (IMC) at the joint region, and therefore it was diffused away through the Mg matrix. Within the joint interface, a slight increase of micro-hardness was observed compared to Mg base metal alloy. This was attributed to the formation and presence of IMC's within the joint region. It was noticed that the presence of the Sn interlayer improved the joint strength by reducing the pores at the joint region. Pores were clearly observed for those bonds made using Cu coatings-especially for region where the fracture occurs; this was accomplished by scanning electron microscope (SEM).

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“…[5] To prevent direct reaction between the Al and Mg alloys, an insert material, composed of pure copper (Cu), pure nickel (Ni), or pure titanium (Ti), separated the alloys. The insert material provided a good diffusion reaction layer, having a thickness on the order of nanometers.…”

Section: Introductionmentioning

confidence: 99%

Forge Welding of Magnesium Alloy to Aluminum Alloy Using a Cu, Ni, or Ti Interlayer

Yamagishi

Sumioka

Kakiuchi

et al. 2015

Metall Mater Trans A

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HIDEKI YAMAGISHI, JUNJI SUMIOKA, SHIGEKI KAKIUCHI, SHOGO TOMIDA, KOUICHI TAKEDA, and KOUICHI SHIMAZAKI The forge-welding process was examined to develop a high-strength bonding application of magnesium (Mg) alloy to aluminum (Al) alloy under high-productivity conditions. The effect of the insert material on the tensile strength of the joints, under various preheat temperatures and pressures, was investigated by analyzing the reaction layers of the bonded interface. The tensile strengths resulting from direct bonding, using pure copper (Cu), pure nickel (Ni), and pure titanium (Ti) inserts were 56, 100, 119, and 151 MPa, respectively. The maximum joint strength reached 93 pct with respect to the Mg cast billet. During high-pressure bonding, a microscopic plastic flow occurred that contributed to an anchor effect and the generation of a newly formed surface at the interface, particularly prominent with the Ti insert in the form of an oxide layer. The bonded interfaces of the maximum-strength inserts were investigated using scanning electron microscopy-energy-dispersive spectroscopy and electron probe microanalysis. The diffusion reaction layer at the bonded interface consisted of brittle Al-Mg intermetallics having a thickness of approximately 30 lm. In contrast, for the three inserts, the thicknesses of the diffusion reaction layer were infinitely thin. For the pure Ti insert, exhibiting the maximum tensile strength value among the inserts tested, focused ion beam-transmission electron microscopy-EDS analysis revealed a 60-nm-thick Al-Ti reaction layer, which had formed at the bonded interface on the Mg alloy side. Thus, a high-strength Al-Mg bonding method in air was demonstrated, suitable for mass production.

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An investigation on diffusion bonding of aluminum and magnesium using a Ni interlayer

Cited by 96 publications

References 20 publications

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers

Forge Welding of Magnesium Alloy to Aluminum Alloy Using a Cu, Ni, or Ti Interlayer

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