“…In the literature, such interactions have been reported by few diffusion bonding studies [15][16][17][18][19][20][21]. Interestingly, Zhang et al studied the joining process between a Zr-based BMG (Zr 62 Cu 33 Al 4 Ti) and a Zn alloy (3 wt% Al) around 415°C, i.e above both the glass transition temperature of the BMG (T g =410°C) and the liquidus temperature of the Zn alloy (T L =397°C) [15,16].…”