2015
DOI: 10.1016/j.matdes.2015.06.028
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Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

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Cited by 11 publications
(1 citation statement)
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References 33 publications
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“…In the literature, such interactions have been reported by few diffusion bonding studies [15][16][17][18][19][20][21]. Interestingly, Zhang et al studied the joining process between a Zr-based BMG (Zr 62 Cu 33 Al 4 Ti) and a Zn alloy (3 wt% Al) around 415°C, i.e above both the glass transition temperature of the BMG (T g =410°C) and the liquidus temperature of the Zn alloy (T L =397°C) [15,16].…”
Section: Introductionmentioning
confidence: 99%
“…In the literature, such interactions have been reported by few diffusion bonding studies [15][16][17][18][19][20][21]. Interestingly, Zhang et al studied the joining process between a Zr-based BMG (Zr 62 Cu 33 Al 4 Ti) and a Zn alloy (3 wt% Al) around 415°C, i.e above both the glass transition temperature of the BMG (T g =410°C) and the liquidus temperature of the Zn alloy (T L =397°C) [15,16].…”
Section: Introductionmentioning
confidence: 99%