An investigation of microstrip conductor loss

Rautio, James C.

doi:10.1109/6668.893247

Cited by 42 publications

(37 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…From the above equation, if the frequency is quadrupled then skin depth is halved, the current now flows in only half of the original cross-section; hence the resistance doubles [14]. Note that magnetic permeability also affects δ.…”

Section: B Skin Effectmentioning

confidence: 92%

See 1 more Smart Citation

Effect of metallization on RF properties of PZT-based transmission lines

Nadzar

Sulaiman

Salleh

et al. 2011

2011 IEEE International RF &Amp; Microwave Conference

View full text Add to dashboard Cite

This paper describes the material parameters which affect high frequency transmission lines built on ferroelectric lead zirconate titanate (PZT) thin films. The electrical characteristics of two transmission line (TL) structures, namely microstrip (MS) and coplanar waveguide (CPW), were studied over 1 to 20 GHz using electromagnetic simulation and verified through measurement. The characteristics were studied by simulating the insertion loss of the lines using four different types of metals namely Pt, Au, Ni and W. The effect of metallization on rf properties was due to metal conductivity and skin effect. The length of the line was set constant at 100 µm and the electrode thickness 0.1 µm, the PZT thickness was 0.5 µm. The relative permittivities of PZT used for MS and CPW were 87 and 112 respectively. The dielectric properties of the PZT films were obtained from previous capacitance measurements over the said frequency range. Results of this study show that the structures exhibit similar performance, with Pt showing the lowest loss for all given electrodes. These results suggest Pt as the preferred conductor for building transmission lines and circuit elements on PZT-based microwave integrated circuits (MIC).Index Terms-Lead zirconate titanate, skin effect, microstrip and co-planar transmission lines, microwave integrated circuit.

show abstract

Section: B Skin Effectmentioning

confidence: 92%

“…As the current becomes more and more confined to the surface, resistance increases. The skin depth ä is given by [14];…”

Section: B Skin Effectmentioning

confidence: 99%

Effect of metallization on RF properties of PZT-based transmission lines

Nadzar

Sulaiman

Salleh

et al. 2011

2011 IEEE International RF &Amp; Microwave Conference

View full text Add to dashboard Cite

show abstract

“…In this case, the alternating current conduction can be described by the well-known skin effect, the skin depth δ c , and the surface impedance Z s [2,3]. At low frequencies, i.e.…”

Section: Current Conduction In Thin Layer Of a Conductive Pastementioning

confidence: 99%

Electromagnetic properties of materials used for paper printed RFID tag antennas

Dziedzic

Słobodzian²

2009

2009 International Conference on Electromagnetics in Advanced Applications

View full text Add to dashboard Cite

The paper presents the results of experimental investigation into electromagnetic properties of key materials used to fabricate paper printed RFID tag antennas, i.e. paper substrates and conductive paste. The low and high frequency conductivity of silver-loaded paste is investigated under specific parameters of the printing process. Electrical parameters of different corrugated board types and solid paper are also investigated. The results shown in this work can serve as reference data for designing RFID tag antennas.

show abstract

“…6 for frequencies varying from DC to 10 GHz. Different frequencies exhibit distinctly different conductor loss characteristics [8]. At low frequencies where skin depth δ is large compared to conductor thickness t, electric current is evenly distributed throughout the conductor volume.…”

Section: A Microstrip Benchmarkmentioning

confidence: 99%

High performance domain decomposition methods for signal integrity modeling in 3-D interconnects

Peng

Shao

2014

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems

View full text Add to dashboard Cite

Advances in interconnect technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for higher functionality and superior performance while reducing size, power, and cost in modern integrated circuit and packages. However, whether or not the package preserves signal integrity has become a crucial concern for system designers. In this study, a scalable multi-scale fullwave electromagnetic solver is proposed for 3-D circuit/package simulations. The key ideas of the proposed work include: (1) adaptive geometry-aware domain decomposition methods to conquer the geometric complexity of physical domain, by which an arbitrarily complicated interconnect model can be decomposed into a collection of components, the so-called sub-domains; (2) a flexibly hybrid solution strategy, where volume-based differential equation solvers and surface-based integral solvers can be applied to individual sub-domain problems based on local characteristics; and (3) parallel and scalable computational algorithms to reduce the time complexity via high performance computing architectures. The strength and flexibility of the proposed method will be illustrated by means of several product-level package benchmark.

show abstract

An investigation of microstrip conductor loss

Cited by 42 publications

References 0 publications

Effect of metallization on RF properties of PZT-based transmission lines

Effect of metallization on RF properties of PZT-based transmission lines

Electromagnetic properties of materials used for paper printed RFID tag antennas

High performance domain decomposition methods for signal integrity modeling in 3-D interconnects

Contact Info

Product

Resources

About