An Integrated LVDS Transmitter–Receiver System With Increased Self-Immunity to EMI in 0.18-um CMOS

Matig-a, Gilbert Andrew; Yuce, Mehmet Rasit; Redouté, Jean-Michel

doi:10.1109/temc.2015.2505005

Cited by 9 publications

(1 citation statement)

References 14 publications

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“…This means that reducing power consumption is critical for battery-powered systems to extend battery life. Low voltage differential signaling (LVDS), as one of the data transmission standards, is now pervasive in communication networks and is used extensively in applications such as laptop computers [1], office imaging [2,3], and medical [4] and automotive [5,6] applications. It features a low-voltage swing (250-400 mV) and achieves a high data rate (up to several gigahertz per single pair) with less power dissipation.…”

Section: Introductionmentioning

confidence: 99%

A 2.5 Gbps, 10-Lane, Low-Power, LVDS Transceiver in 28 nm CMOS Technology

et al. 2019

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This paper presents a 2.5 Gbps 10-lane low-power low voltage differential signaling (LVDS) transceiver for a high-speed serial interface. In the transmitter, a complementary MOS H-bridge output driver with a common mode feedback (CMFB) circuit was used to achieve a stipulated common mode voltage over process, voltage and temperature (PVT) variations. The receiver was composed of a pre-stage common mode voltage shifter and a rail-to-rail comparator. The common mode voltage shifter with an error amplifier shifted the common mode voltage of the input signal to the required range, thereby the following rail-to-rail comparator obtained the maximum transconductance to recover the signal. The chip was fabricated using SMIC 28 nm CMOS technology, and had an area of 1.46 mm2. The measured results showed that the output swing of the transmitter was around 350 mV, with a root-mean-square (RMS) jitter of 3.65 ps@2.5 Gbps, and the power consumption of each lane was 16.51 mW under a 1.8 V power supply.

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