An integrated LTCC millimeter-wave planar array antenna with low-loss feeding network

Abstract

A novel configuration of millimeter-wave planar array antenna based on low-temperature cofired ceramic (LTCC) technology is investigated. The configuration exploits the three-dimensional (3-D) integration feature of LTCC by incorporating a novel quasi-cavity-backed patch (QCBP) element using a pair of grid-like conductor walls and a mixed feeding network configuration. A proposed LTCC planar array antenna consisting of 16 by 16 elements is designed, manufactured and tested. Good agreement is achieved between the theoretical performance and the measured results.

A compact 2-18GHz ultra-wideband frequency-conversion T/R module based on a 3D heterogeneous integrated process

“…Due to its large dimensions, it is not conducive to system integration. In order to achieve miniaturization, some modules adopt a ceramic package with ball grid array (BGA) and high/low-temperature co-fired ceramic (HTCC/LTCC) technology for fabrication [10][11][12][13][14][15][16][17][18][19][20], which increases the module integration to some extent. However, these designs still employ a two-dimensional (2D) multichip module (MCM) package, the minimum sizes of which are limited by the sizes of the applied chips.…”

Low-Cost Unattended Design of Miniaturized 4 × 4 Butler Matrices with Nonstandard Phase Differences

“…Common array feeding realizations include variants of corporate [7][8][9] and series networks [10][11][12]. More complex structures are based on a combination of series-parallel feeds [13], networks with tunable power dividers [14], as well as structures dedicated to operating in mm-wave spectrum [15]. Butler matrices (BMs) and their derivatives belong to another class of feeding networks [16][17][18][19][20].…”