2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2022
DOI: 10.1109/itherm54085.2022.9899653
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An Integrated Cooling Effect Package for High Performance Computing Chips

Bo-Jiun Yang
1
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Taiyu Chen
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,
Tsung-Yu Pan
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et al.
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A Novel Stacked-via Cu/ELK Interconnection Design Configuration to Enhance Advanced Si Packages Reliability Performance

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