An Integrated Conical Spring Linear Actuator.

Hata, Seiichi; Kato, Tomokazu; Fukushige, Takashi; Shimokohbe, Akira

doi:10.2493/jjspe.69.438

Cited by 5 publications

(9 citation statements)

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“…Our previous investigation revealed that there is a pull-in voltage in the driving characteristics of a conical spring microactuator [10]. In addition, the necessary driving voltage turned out to be equal to the pull-in voltage.…”

Section: B Electrical Modelmentioning

confidence: 97%

“…These characteristics of TFMG enable the fabrication of 3-D microstructures [6]- [10], [14], [18], [19]. In the present paper, we have employed a three-dimensional microforming process in which the TFMG is deformed elastically at room temperature, heated to the SCLR to release the elastic stress, and then cooled to room temperature to fix the form.…”

Section: A Thin Film Metallic Glass (Tfmg)mentioning

confidence: 99%

“…1 [9], [10]. The conical spring microactuator is one of several curved cantilever actuators developed recently [11]- [13], which have long strokes compared with their size and the driving voltage.…”

Section: Introductionmentioning

confidence: 99%

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A MEMS conical spring actuator array

Fukushige

Hata

Shimokohbe

2005

J. Microelectromech. Syst.

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A new MEMS conical spring actuator array is proposed. Previously, we have developed conical spring microactuators having a long stroke (180 m) in the out-of-plane direction.However, the maximum output force and the packing density were not satisfactory. In the present paper, mechanical and electrical models of a conical spring are described for the calculation of the maximum output force and the driving voltage. Geometrical parameters were optimized using these models and a new geometry for the actuator was derived. The new geometry incorporates a wider and thicker spring that increased the maximum output force from 0.087 mN up to 0.83 mN. The packing density was increased up to 1 actuator mm 2 using an additional interconnect layer. In addition, the driving voltage was decreased using a thinner insulating layer. The use of an ac drive prevented the sticking of the actuator during operation. A detailed investigation of the ac drive was also performed.[1304]Index Terms-AC drive, conical spring microactuator, out-ofplane, thin film metallic glass, three-dimensional (3-D) shape.

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Section: B Electrical Modelmentioning

confidence: 97%

Section: A Thin Film Metallic Glass (Tfmg)mentioning

confidence: 99%

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A MEMS conical spring actuator array

Fukushige

Hata

Shimokohbe

2005

J. Microelectromech. Syst.

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“…Usually formation procedure utilizes photolithography processes to define pattern of an antenna over a metal layer sputtered above a dielectric layer [1][2][3]. Formation of MEMS structure for vibration energy harvesters is of the same technique [6,7].…”

Section: Formation Technologymentioning

confidence: 99%

“…Several applications of conical helices have been already presented in the past: as antennas for THz [5] detection and imaging, as electrostatic actuator [7], as spiral beam vibration energy harvester [8]. In this work, we present design and micro-fabrication processes for formation of the comvester, consisting of a long piezoelectric beam shaped as a conical helix, providing both communication and energy harvesting functions.…”

Section: Introductionmentioning

confidence: 99%

3D Antenna for GHz application and vibration energy harvesting

Kholostov

Nenzi

Palma

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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In this work we present a new design for a three-dimensional vibration energy harvester, which is made by Micro-Electro-Mechanical Systems (MEMS) technology, and which can convert electric energy through transverse mode piezoelectric effect. The presented power generator is based on a long, thick-film, piezoelectric beam configured as a conical helix structure and located between two metal electrodes. The design of the combined antenna/energy harvester (comvester, from communication and energy harvester) device addresses both electromagnetic and mechanical issues as it radiates electromagnetic energy and converts mechanical energy into electric energy. Both functions are translated directly into dimensional constraints of the structure. In this work, we concentrate on millimeter waves communications in the 60 GHz frequency band because of their availability for low-power CMOS radio circuits. In order to realize comvester on a silicon wafer we used Controlled Release Metal Layer (CRML) technology, which is a transfer layer technology that uses porous silicon as sacrificial material. The advantage of CRML technology is high repeatability and resolution and its compatibility with back-end of line processes of the integrated circuit industry. New type of piezoelectric material consisted of the array of separated vertical polyvinylidene fluoride (PVDF) microrods is suggested. Such periodic microrods structure became possible to realize using the template of the structured macroporous silicon. © 2013 IEEE

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A review of deformation and fatigue of metals at small size scales

Connolley

McHugh

Bruzzi

2005

Fatigue Fract Eng Mat Struct

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A B S T R A C T Mechanical devices are being introduced whose size scale is well below that of conventional mechanical test specimens. The smallest devices have sizes in the nanometer range, though a good proportion of structural devices are of the micrometer scale. Development of these products raises the question of how their mechanical behaviour and reliability may be predicted. Conventional macroscopic test data can be used, but these are obtained using specimens whose size is much larger than the devices themselves. There is a risk that performance predictions will be inaccurate, due to the existence of size effects. This paper covers small size scale testing in metallic specimens and devices, concentrating on freestanding specimens. To begin, some examples of micro-scale devices are given. Fabrication methods for small metallic devices are then briefly described. This is followed by a review of experimental observations of mechanical properties in various metallic materials at the micro-scale, highlighting the differences in results from different research groups and the gaps in our current knowledge. A section on computational and predictive modelling is included, in recognition of the role of modelling in device design and testing. Overall, the findings are that size effects are common, particularly in crystalline samples when the grain size is similar to one or more of the specimen dimensions. However, observations of size effects differ between studies and mechanical properties can vary widely, even for the same type of material. As a consequence, the relationships between specific device processing methods, specimen size and material properties must be adequately understood to ensure successful performance. N O M E N C L A T U R EA = geometric texture factor b = Burgers vector magnitude d = grain diameter D f = fatigue ductility parameter E = elastic modulus h = film, foil or specimen thickness k = 'locking parameter,' representing the relative hardening contribution of grain boundaries K = constant for power law creep k B = Boltzmann constant l = specimen length n = Creep exponent for power law creep N f = number of cycles to failure p = constant in the Basquin and Coffin-Manson relationships

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An Integrated Conical Spring Linear Actuator.

Cited by 5 publications

References 0 publications

A MEMS conical spring actuator array

A MEMS conical spring actuator array

3D Antenna for GHz application and vibration energy harvesting

A review of deformation and fatigue of metals at small size scales

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