An integrated approach to power electronics systems

Lee, F.C.; Wyk, J.D. van; Boroyevich, Dushan; Barbosa, Peter

doi:10.1109/pcc.2002.998503

Cited by 25 publications

(10 citation statements)

References 36 publications

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“…Therefore, a filter with appropriate chosen parameters fulfills condition (6) during steady state operation. The relation between the inductor and output currents is obtained from (4) and (12) as follows: …”

Section: Fig 3 (A) Hybrid Structured Buck Converter; (B) Inverting mentioning

confidence: 99%

“…Nevertheless, because traditional approaches for SMPC implementation rely on discrete components, many modern concepts have joined and integrated diverse functionality in to a single integrated power module (IPEM) [1], [2]. There are tremendous efforts being made to replace physical elements with 'smart' algorithms and approaches, for example, it is far more economically justified to improve the electromagnetic compatibility (EMC) of an SMPC using modulation strategy, than with costly and bulky EMI filters [3], [4], [5], [6]. Lower output voltage, higher output current, and smaller output voltage ripple requirements have greatly increased the difficulty of the power supply design.…”

Section: Introductionmentioning

confidence: 99%

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Capacitor-less Buck Converter

Kapun¹,

Truntič

Hren

et al. 2011

Automatika

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Original scientific paperLow-power switched-mode power supply converters are used in applications where size and efficiency are critical. The buck converter size can be reduced by elimination of the bulky filter capacitor. The filtering function of this capacitor can be replaced by an output current ripple compensation circuit. The compensating circuit is applied, based on inductor current measurement and linear amplifier. The proposed compensating algorithm is investigated theoretically by simulation, and verified experimentally.Key words: dc-dc buck converter, low power, inductor current ripple compensation Silazni DC-DC pretvarač bez izlaznog kondenzatora. DC-DC pretvarači malih snaga se koriste u uredjajima gdje su važni dimenzije i učinkovitost. Dimenzije pretvarača se mogu smanjiti sa izostavljanjem filtarskog kondenzatora. Umjesto sa kondenzatorom se funkcija gladjenja izlaznog napona može izvesti sa kompenzacijom valovitosti struje zavojnice. Za kompenzaciju valovitosti struje je potrebno mjeriti trenutnu vrijednost struje induktora koja se preko obrade u linearnom pojačalu dodaje u protifazi struji zavojnice. Predloženi kompenzacijski postupak je istraživan teoretski te verificirani simulacijski i eksperimentalno.Ključne riječi: dc-dc silazni pretvarač, mala snaga, kompenzacija valovitosti struje zavojnice

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Section: Fig 3 (A) Hybrid Structured Buck Converter; (B) Inverting mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Capacitor-less Buck Converter

Kapun¹,

Truntič

Hren

et al. 2011

Automatika

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“…Furthermore, packaging and integration, being associated to physical realization of power converters are closely related and identified as dominant technology barriers toward the growth of power conversion applications [9].…”

Section: Integration and Packagingmentioning

confidence: 99%

An Approach to Deal With Packaging in Power Electronics

Popović

Ferreira

2005

IEEE Trans. Power Electron.

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Abstract-Current packaging technology in power electronics is based on assembling pre-manufactured discrete components. Each component consists of a number of parts, manufactured in a variety of manufacturing processes. This has resulted in a diversity of construction parts and mutually incompatible manufacturing processes in a typical power electronic converter and has brought power electronics to the edge where it becomes extremely difficult to reduce the cost and size of power electronic converters. This also makes integration of power electronic converters difficult.In this paper, we present a way to improve the physical construction of power electronic converters by increasing level of integration and using multifunctional construction parts. integration and packaging are two important aspects of physical construction of power electronic converters. Both of them and their mutual relationship are discussed in the paper. Three quantities intended to evaluate integration level and volumetric utilization namely functional elements integration level, ; packaging elements integration level ; and volumetric packaging efficiency v are introduced. Based on these values, a number of techniques to increase the integration level are presented. A design process in the form of a flowchart intended to implement these techniques in concrete design cases is presented.Index Terms-Functional elements (FEs) integration level, packaging elements (PEs) integration level, power electronic converters, volumetric packaging efficiency.

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“…Due to the relatively low thermal conductivities associated with the outer material layers of these integrated power electronic modules, surface cooling on its own is no longer sufficient to keep core temperatures within allowed ranges, resulting in the constituting materials themselves acting as major thermal barriers. Associated with the high external thermal impedance, a restriction is placed on the maximum achievable power densities within such electronic modules [1,2].…”

Section: Introductionmentioning

confidence: 99%