An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards

Silva, Vitor Luiz da; Oliveira, Rui de; Watts, D.; Bij, E. van der

doi:10.1108/03056120410539885

Cited by 3 publications

(1 citation statement)

References 2 publications

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“…The filling of blind vias or through holes by copper electroplating has become a popular and vital technology in the field of printed circuit boards (PCBs), especially in high-density interconnection (Da Silva et al, 2004;Das et al, 2008) and integrated circuit (IC) substrate packages (Zhang et al, 2009;Shen et al, 2014). Utilizing vias filled by full copper enables further package densification by facilitating via-in-pad or padless designs.…”

Section: Introductionmentioning

confidence: 99%

Factors governing filling of blind via and through hole in electroplating

Wang¹,

Wu²,

Cui³

2014

Circuit World

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Purpose – The purpose of this paper is to present a clear picture of the key factors of blind via and through hole filling in electroplating, e.g. shape of via or hole, electroplating solution, process, as well as the developments of mechanisms and models. Design/methodology/approach – First, the paper details the development trends and challenges of via filling. Then the research status of mechanisms, electroplating solutions, including base solution and additives, numerical model and mass transfer is described. Finally, through hole filling is briefly reviewed. Findings – To achieve excellent via filling performance, the characteristics of the via or hole, the ratio of acid/copper, selection of additives and factors of mass transfer are comprehensively considered in terms of optimization of the electroplating process. It is beneficial to design vias with appropriate aspect ratios, to strengthen the adsorption of the accelerator in the via bottom, to inhibit the increase of surface copper thickness and to form butterfly-shaped copper in the centre of through holes. Optimized process parameters should be taken into consideration in superfilling. Originality/value – The paper reviews different sets of additives, mechanisms and superfilling models for state-of-the-art via filling and the developments of filling for through holes.

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Section: Introductionmentioning

confidence: 99%

Factors governing filling of blind via and through hole in electroplating

Wang¹,

Wu²,

Cui³

2014

Circuit World

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Improvement of plating adhesion on PhotoVia substrates

Hamáček

Kidora

Reboun

2007

2007 30th International Spring Seminar on Electronics Technology (ISSE)

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This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter ofinterconnection vias. Photo Via method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness ofdielectric surface and adhesion ofconductive layer were measured.

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First results of spherical GEMS

Pinto

Alfonsi

Brock

et al. 2010

IEEE Nuclear Science Symposuim &Amp; Medical Imaging Conference

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Abstract-We developed a method to make gem foils with a spherical geometry. Tests of this procedure and with the resulting spherical gems are presented. Together with a spherical drift electrode, a spherical conversion gap can be formed. This eliminates the parallax error for detection of x-rays, neutrons or uv photons when a gaseous converter is used. This parallax error limits the spatial resolution at wide scattering angles.Besides spherical gems, we have developed curved spacers to maintain accurate spacing, and a conical field cage to prevent edge distortion of the radial drift field up to the limit of the angular acceptance of the detector. With these components first tests are done in a setup with a spherical entrance window but a planar readout structure; results will be presented and discussed.A flat readout structure poses difficulties, however. Therefore we will show advanced plans to make a prototype of an entirely spherical double-gem detector, including a spherical 2d readout structure. This detector will have a superior position resolution, also at wide angles, and a high rate capability.

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An innovative “ChemicalVia” process for the production of high density interconnect printed circuit boards

Cited by 3 publications

References 2 publications

Factors governing filling of blind via and through hole in electroplating

Factors governing filling of blind via and through hole in electroplating

Improvement of plating adhesion on PhotoVia substrates

First results of spherical GEMS

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