This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter ofinterconnection vias. Photo Via method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness ofdielectric surface and adhesion ofconductive layer were measured.
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