An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

Guo, Lingjun; Zhang, Xinrong; Chen, Shibin; Jiang, Hui

doi:10.3390/ma12010125

Cited by 26 publications

(16 citation statements)

References 13 publications

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“…Prior to nano-indentation and nano-scratching, all wafers should be lapped and polished to be ultra-smooth on both surfaces and damage-free. For high efficiency, a fixed abrasive pad [ 17 , 18 , 19 , 20 , 21 ] was adopted in lapping processing. Thereby, 50 wt.% of W14 diamond grits (grain size of 10–14 μm) were fixed into this lapping pad, and the slurry was the deionized water only mixed with 0.2% OP-10.…”

Section: Methodsmentioning

confidence: 99%

Effect of the Anisotropy Mechanical Properties on LN Crystals Fixed-Abrasive Lapping

et al. 2020

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The anisotropy of lithium niobate (LN) single crystals in mechanical properties affects its material removal uniformity during lapping. The nano-indentation hardness (HI) and elastic modulus(E) of Z-cut wafer and X-cut wafer were measured by a nano-indentation tester. The nano-scratching tests were adopted to evaluate its critical cutting depth (dc) of brittle ductile transition along crucial orientations of Z-cut and X-cut, respectively. A series of fixed-abrasive lapping tests were carried out to explore the effect of anisotropy on the lapping process. The results indicated that the HI of Z-cut was slightly higher than that of X-cut, while the E of Z-cut was about 1.1 times of the latter. The dc value of each orientation varies greatly. The lapping tests showed that the material removal rate (MRR) of Z-cut was lower than that of X-cut, for its high HI and E. Meanwhile, the surface quality of Z-cut was better than that of X-cut, for the larger dc of Z-cut. The research of mechanical properties of LN has guiding significance for its lapping process.

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Section: Methodsmentioning

confidence: 99%

Effect of the Anisotropy Mechanical Properties on LN Crystals Fixed-Abrasive Lapping

et al. 2020

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“…Authors have also detected the formation of various biocompatible phases, whose appearance enhances the corrosion performance and biomechanical integrity of manufactured structures. Guo et al [3] proposed ultraviolet-curable resin bonding for a precision abrasive machining tool, aiming to deliver a rapid, flexible, economical, and environment-friendly additive manufacturing process to replace the hot press and sintering process. Authors have employed a customized ultraviolet curing system based on the Machine UV-100, and the Dymax 5000 flood ultraviolet curing system used for the initial material properties test of the cured ultraviolet-curable resin composites.…”

Section: Ofmentioning

confidence: 99%

Advances in Hard–to–Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity

2020

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The rapid growth of a modern industry results in a growing demand for construction materials with excellent operational properties. However, the improved features of these materials can significantly hinder their manufacturing, therefore they can be defined as hard–to–cut. The main difficulties during the manufacturing/processing of hard–to–cut materials are attributed to their high hardness and abrasion resistance, high strength at room or elevated temperatures, increased thermal conductivity, as well as their resistance to oxidation and corrosion. Nowadays the group of hard–to–cut materials includes the metallic materials, composites, as well as ceramics. This special issue, “Advances in Hard–to–Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity” provides a collection of research papers regarding the various problems correlated with hard–to–cut materials. The analysis of these studies reveals primary directions regarding the developments in manufacturing methods, and the characterization and optimization of hard–to–cut materials.

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“…The ultraviolet-curable epoxy resin prepared for this study was supplied by Dymax Corporation (Torrington, USA) and labeled as Light-Weld 425 optically clear structural adhesive. In the previous study [17], [18], we have compared the material properties of the cured ultraviolet-curable resin that purchased from varies vendors. The 425-resin mentioned above showed some favorable advantages over the others, in terms of the properties of hardness, strength and wear resistance to meet the requirement to be employed as the bonding agent in the manufacturing of abrasive tools.…”

Section: A Materials Preparationmentioning

confidence: 99%

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

et al. 2019

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Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive lapping plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive lapping plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive lapping, the slurry-based lapping and this originally developed plate involved lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin plate lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously. INDEX TERMS Material processing, sapphire substrate, tool manufacturing. I. INTRODUCTION A. MATERIAL AND MACHINING PROCESS Sapphire is the single crystal form of the compound Al 2 O 3 (α-alumina), and it is the second hardest natural material after diamond. As one of the most recognized highquality opto-mechatronic materials in the industry, it has been used broadly in various fields covering consumer electronics and military equipment. For instance, because of the superior material properties in physical strength, hardness, and The associate editor coordinating the review of this manuscript and approving it for publication was Bora Onat. high-temperature resistance, sapphire possesses the capability to endure the severe conditions of GaN film deposition, and which make sapphire became the predominate substrate material for light emitting diode (LED) applications [1]-[3]. Moreover, sapphire is also a wide gap (up to 0.9 eV) insulator presenting multiple favorable properties including the refractory behavior and transparency over a wide wavelength range, which enables sapphire to be employed as the laser diodes, optical materials or even insulator in a nuclear reactor [4], [5]. The machining process of sapphire substrate usually starts from the sawing of a sapphire cylinder bar of 50mm to 150mm in diameter, and following a sequence of precision

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An Experimental Study on the Precision Abrasive Machining Process of Hard and Brittle Materials with Ultraviolet-Resin Bond Diamond Abrasive Tools

Cited by 26 publications

References 13 publications

Effect of the Anisotropy Mechanical Properties on LN Crystals Fixed-Abrasive Lapping

Effect of the Anisotropy Mechanical Properties on LN Crystals Fixed-Abrasive Lapping

Advances in Hard–to–Cut Materials: Manufacturing, Properties, Process Mechanics and Evaluation of Surface Integrity

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

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