An experimental study of an anti-gravity vapor chamber with a tree-shaped evaporator

Yao, Feng; Miao, Shuangshuang; Zhang, Mengchen; Chen, Yongping

doi:10.1016/j.applthermaleng.2018.06.053

Cited by 33 publications

(16 citation statements)

References 24 publications

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“…Yao et al [30] developed a vapor chamber characterized by a tree-shaped groove wick and a screen mesh wick that fills the vapor area. Their vapor chamber showed better performance in the top heating mode with mesh wicks, and with very small increases in thermal resistances.…”

Section: Introductionmentioning

confidence: 99%

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

et al. 2022

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In the current study, a hemispherical shell vapor chamber (HSVC) was proposed and manufactured. A unique system of the HSVC consists of a very short evaporator space and a large condenser area with an inner and outer surface. The HSVC has a bottom surface that can be easily attached to the heat source and its radius varies from 0.045 m (near the bottom surface) to 0.078 m at the top with a curved side. An entirely new design of the integrated section of the large condenser with the evaporator section was verified using a new but simple concept. The current hemispherical shell vapor chamber (HSVC) was made from stainless steel. The current HSVC was specified with an outer/inner diameter of 78/70 mm at the top, a depth of 47 mm in the inner surface area, a total height of 60 mm, 30 mm at the bottom of the inner center, and a diameter of 45 mm on the surface of the outer bottom area. Three different models were manufactured and tested to verify which HSVC reached a high thermal performance. The effects of various operation parameters such as the filled volume ratio, heat load, coolant flow velocity, orientation, and so forth, were investigated experimentally. The experimental results showed that the optimum charge amount in terms of temperature difference is 20–30% of the charging ratio, and the condenser area has a direct effect on the thermal performance. Moreover, a one-dimensional thermal resistance model was tested to predict and simulate the thermal performance of the current system associated with various empirical correlations. Furthermore, the CFD (Computational Fluid Dynamics) model can simulate a lot of detailed flow behavior inside the HSVC. Both simulation methods can predict the thermal performance of the HSVC, and they can help to design the system with a focus on the optimum configuration of the design target for any application.

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Section: Introductionmentioning

confidence: 99%

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

et al. 2022

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“…Moreover, the wick structure for the condenser combines the fractal network microchannels and copper foam, which are used to imitate the macroscopic leaf vein network and microscopic mesophyll tissue, respectively, which are also higher than most existing vapor chambers (Luo et al, 2020). To obtain better performance, the smaller size powder, reducing the diameter and spacing of the support columns (Huang et al, 2020;Liu et al, 2018), with a mini channel with a wick layer (Wiriyasart and Naphon, 2018b), micro/nanostructured evaporator (Sun and Qiu, 2014), grooves, and hybrid mesh wick (Yao et al, 2018), hybrid wick Constant Conductance Heat Pipes (CCHPs) (Ababneh et al, 2015), much lower than that of vapor chamber with bare sintered wick by enhanced both the critical heat flux (CHF) and heat transfer coefficient (HTC) to solve the high heat flux limitation for future highly integrated electronics. Also, the configuration of the evaporator wick porosity should be slightly larger than the condenser wick porosity to provide the maximum pressure drop in the wicks and slightly less than the maximum capillary pressure .…”

Section: Introductionmentioning

confidence: 99%

Transient thermal performance of constant fill ratio vapor chamber with different coolants

Wiriyasart

Naphon

2021

JTST

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In this study, a constant fill ratio vapor chamber using water and ferrofluid as the coolants on the thermal performance and thermal optimization to provide the cooling range are presented. The liquid flow rate of the condenser side ranges from 0.029−0.099 kg/s, the input power of 100−300 W, heat source size of 30 mm × 30 mm, and the water and ferrofluid with φ=0 %, φ=0.005 % and φ=0.05 % as coolants are investigated. The results indicate that the minimum thermal resistance of a traditional vapor chamber of 0.126 o C/W at m o = 0.075 kg/s and vapor chamber with a mini channel of 0.077 o C/W at m o = 0.049 kg/s at φ=0.005 % are obtained. The vapor chamber with and without mini channel at a certain fill ratio of 26 % and 33 %, the heat source size of 30 mm × 30 mm, and the mass flow rate of ≥ 0.042 kg/s are withstanding the heat load range from 100-200 W. However, to achieve the high heat load range from 100-300 W, the vapor chamber with mini channel using the Fe3O4 ferrofluid φ=0.005 % is covering the entire cooling range and is recommended in electronic cooling applications.

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“…At present, electronic devices tend to be miniaturized and compact [1,2]. Therefore, the power density of electronic devices is increasing [3]. In order to meet the heat dissipation requirements, the cooling equipment must be efficient and flexible enough [4].…”

Section: Introductionmentioning

confidence: 99%

“…It is a special form of flat heat pipe [5], and is often used for thermal management of electronic devices [6]. The vapor chamber is composed of shell, wick, and steam chamber [3]. There is working fluid inside the vapor chamber.…”

Section: Introductionmentioning

confidence: 99%

Research on a Simplified Model of an Aluminum Vapor Chamber in a Heat Dissipation System

Han

Yang

Tian

et al. 2019

Entropy

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With the rapid increase of power densities of electronic components, the traditional heat dissipation method of air forced convection has reached a heat transfer limit. As efficient phase change heat exchangers, vapor chambers have become an important guarantee for the development of high-power electronic components. Aluminum vapor chambers have become the future development trend because they are more lightweight and less expensive. In order to study the suitable simplified model of the aluminum vapor chamber in the radiating system, the testing system is established to test the thermal characteristics of the vapor chamber. First, six simplified models of the vapor chamber are proposed. Then, the thermal characteristics of the simplified models are simulated by STAR CCM+ software. Next, the error of the thermal resistance of the simplified model and the real vapor chamber is analyzed. Finally, a most suitable simplified model is obtained in the cooling system.

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An experimental study of an anti-gravity vapor chamber with a tree-shaped evaporator

Cited by 33 publications

References 24 publications

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

Transient thermal performance of constant fill ratio vapor chamber with different coolants

Research on a Simplified Model of an Aluminum Vapor Chamber in a Heat Dissipation System

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