Research on a Simplified Model of an Aluminum Vapor Chamber in a Heat Dissipation System

Han, Shuang; Yang, Lixin; Tian, Zihao; Yuan, Xiaofei; Han, Lu

doi:10.3390/e22010035

Cited by 7 publications

(5 citation statements)

References 28 publications

(51 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the engineering design, the flow process convection of the working fluid in the heat pipe is usually simplified. 18 Thus, the thermal conductivity model containing the wick and the vapor core is used instead. In this way, it’s not necessary to be solve the flow equation for the heat transfer model of the heat pipe, but heat conduction equation, 19 expressed by equation (1), is required.…”

Section: Mathematical Model Descriptionmentioning

confidence: 99%

Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source

Wang

Tang

et al. 2022

Advances in Mechanical Engineering

View full text Add to dashboard Cite

In a high-power microwave device, the intense electron beam causes a high-heat-flux on the collector’s inner surface which results in an instant temperature increase which eventually causes the output power to drop. The vapor chamber is one of the passive cooling devices effective for high-heat-flux heat dissipation. To study the heat dissipation capacity and the surface temperature control effect of the vapor chamber, a numerical heat transfer model of the vapor chamber is proposed based on the effective thermal conductivity method. The accuracy of the steady-state heat transfer analysis and the applicability of the transient simulation are verified by comparing with experimental data, and the heat transfer are calculated under the condition of periodic pulsed heat sources. Lastly, the transient performance of a vapor chamber relative to a copper heat spreader of the same external dimensions is investigated as a function of the wick effective thermal conductivity, pulsed heat flux, and pulse duration. The transient behavior of the vapor chambers are examined to find a performance threshold to determine if the performance is superior to that of a copper heat spreader. The present work provides a basis to understand the advantages and limitations of metal heat spreader in pulse mode operation of vapor chamber and plays a vital role in the design of improving transient performance.

show abstract

Section: Mathematical Model Descriptionmentioning

confidence: 99%

Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source

Wang

Tang

et al. 2022

Advances in Mechanical Engineering

View full text Add to dashboard Cite

show abstract

“…Aluminium is being preferred in aviation and space cooling applications due to its low weight to strength ratio. 120 As there are no such constraints related to the cooling system’s weight, copper is the most preferred envelope material for terrestrial applications despite being more expensive than aluminium. The reason is that copper has high thermal conductivity and diffusivity than aluminium, thereby ensuring device operations under permissible temperature limits under steady-state conditions by keeping lower levels of the temperature gradient between the hot and cold ends.…”

Section: Factors Affecting Thermal Performancementioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

show abstract

“…Al in other 11 components are 1-3 orders of magnitude lower. For electronic drives, the most abundant metal is Al which is used as disk substrates in HDD or as shells for good dissipation in SSD (Han et al, 2020;Ma, 2018). Cu concentrations follow Al concentrations at 89 229 mg/kg in HDD and 97 150 mg/kg in SSD.…”

Section: Metal Contentmentioning

confidence: 99%

Comparative effectiveness of technical and regulatory innovations to reduce the burden of electronic waste

Chen

Wang

et al. 2021

Resources, Conservation and Recycling

View full text Add to dashboard Cite

Waste Electrical and Electronic Equipment (WEEE) contain toxic metals and organic compounds, posing significant threats to human health and environmental quality. The risks vary according to equipment types and components that are influenced by innovations in technical configuration and regulatory policy. To disentangle the relative impacts of these influences in protecting health and environment, we investigated 13 WEEE and 14 components using a life cycle impact assessment procedure. Additionally, we analyzed Waste Mobile Phones (WMPs) and Waste Printed Circuit Boards (WPCBs) from computers manufactured between 2002 and 2010 to identify trends of toxic chemicals and potential adverse impacts associated with technological configurations and regulatory policies. The results show that, among WEEE, Cathode Ray Tube TV presented the highest carcinogenicity and non-carcinogenicity toxicity potential. Waste Air Conditioner posed the highest potential for ecotoxicity. Among electronic components, Waste Organic Light Emitting Diode displays posed the highest potential risk for carcinogenesis, whereas WPCBs from laptop computers posed the highest potential risk for non-cancer diseases. Solid State Drives posed the highest risks for ecotoxicity. Chromium was associated with risk of carcinogenesis and non-cancer diseases; whereas Al and Fe posed the highest potential for ecotoxicological impacts. During the period covered by the study, innovations in technological configurations and regulatory policies demonstrably reduced the potential toxicity risks posed by E-waste, attributable to reduction in the concentrations of toxic organic chemicals in WMPs/WPCBs. These results advance current understanding of strategies to reduce the risks posed by WEEE through coordination of technological innovations and regulatory policies.

show abstract

Research on a Simplified Model of an Aluminum Vapor Chamber in a Heat Dissipation System

Cited by 7 publications

References 28 publications

Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source

Studies on heat transfer characteristics of vapor chamber under periodic-pulsed heat source

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Comparative effectiveness of technical and regulatory innovations to reduce the burden of electronic waste

Contact Info

Product

Resources

About