2021
DOI: 10.1016/j.enconman.2021.114608
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An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure

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Cited by 72 publications
(18 citation statements)
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“…This entails discretizing the design domain into finite elements and assigning each element a material pseudo-density, θ ∈ [0, 1], which functions as the design variable. Power and linear functions implemented SIMP method to scale material properties [26] by Equations ( 11)- (13), where the power function applied to interpolate the thermal conductivity reduces the contribution of intermediate values to heat transfer.…”
Section: Initial and Boundary Conditionsmentioning
confidence: 99%
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“…This entails discretizing the design domain into finite elements and assigning each element a material pseudo-density, θ ∈ [0, 1], which functions as the design variable. Power and linear functions implemented SIMP method to scale material properties [26] by Equations ( 11)- (13), where the power function applied to interpolate the thermal conductivity reduces the contribution of intermediate values to heat transfer.…”
Section: Initial and Boundary Conditionsmentioning
confidence: 99%
“…This study aimed to enhance the heat transfer of PCM in the LHTES unit by minimizing the global temperature distribution of the domain. According to the reference [17,26,27], the thermal compliance, which is characteristic of the dissipation of heat transfer capacity, was adapted to the objective function F by Equation ( 16).…”
Section: Objective Functionmentioning
confidence: 99%
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“…Many researchers have taken an effort to bring down the temperature difference between melting PCM and electronic components to get better efficacy. Further to enhance the efficacy of PCMs researchers are investigating various geometries/orientation of fins [2][3][4][5][6] and other thermal conductive enhancer (TCE) methods, 7 both experimentally and numerically.…”
Section: Introductionmentioning
confidence: 99%
“…Recent studies in the field of active and passive methods to improve the thermal performance [33][34][35][36][37][38][39][40][41][42][43][44][45]. …”
mentioning
confidence: 99%