An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments

“…This result is consistent with that obtained from the 3D FEA study on soft-pad grinding of 200 mm wafers (Sun et al, 2004), as well as that from a 2D FEA study on rigid-chuck grinding of 200 mm wire-sawn wafers (Pei et al, 2003). This simulation result has also been substantiated by an experimental observation (Pei et al, 2004). The practical implication of this finding to manufacturing is that wire-sawing should produce wafers with shorter waviness wavelength if possible.…”

“…In that investigation, a 2 4 (four factors, two levels) full factorial design was employed to reveal the main effects and interaction effects of four important factors: elastic modulus, Poisson's ratio and thickness of the soft pad and waviness wavelength of the wafer. An experimental investigation into soft-pad grinding of 200 mm wire-sawn wafers has also been reported (Pei et al, 2004). The experimental results have substantiated the FEA simulation results.…”

Grinding of silicon wafers: A review from historical perspectives

“…11, if the median surface of a wavy wafer deforms elastically during machining (SSG or lapping), after the operation it will spring back to its original shape thus preserving the waviness. Many effects were exerted to improve the effectiveness of SSG in waviness removal, such as soft-pad grinding [83,[86][87][88], wax mounting [89], and reduced vacuum [81]. However, none of these techniques were shown to be feasible in manufacturing.…”

An experimental study of flat fixed abrasive grinding of silicon wafers using resin-bonded diamond pellets

“…The use of finer grained diamond of 15 m leads improvement in surface roughness and damage of approximately 60% compared to coarser grained diamond of 46 m. Pei and Strasbaugh (2002) stated that fine grinding of silicon wafers using a designed experimental investigation displayed the significant interactions between wheel speed, workpiece speed and feed rate, which need to be changed simultaneously to obtain the optimized output performances such as grinding forces, spindle motor current, cycle time, surface roughness and grinding marks. In addition, Pei et al (2004) also indicated that using soft-pad coarse and fine grinding is effective 0924-0136/$ -see front matter © 2008 Elsevier B.V. All rights reserved. doi:10.1016/j.jmatprotec.2008.02.039 in removing waviness induced of wire-sawn silicon wafers.…”