2017
DOI: 10.1109/tmtt.2017.2666808
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An Energy-Efficient and Low-Crosstalk Sub-THz I/O by Surface Plasmonic Polariton Interconnect in CMOS

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Cited by 59 publications
(38 citation statements)
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“…The future work in this area on one hand should produce more high-performance passive and active devices, but more importantly needs to make breakthroughs in two directions: systemlevel applications and CMOS-based integrated circuits [91]. Taking the advantages of spoof SPP/LSP TLs, passive and active devices, an integration study of SPP/LSP systems is highly demanded to reach new technologies of the wireless communications, radar, and EM compatibility.…”
Section: Discussionmentioning
confidence: 99%
“…The future work in this area on one hand should produce more high-performance passive and active devices, but more importantly needs to make breakthroughs in two directions: systemlevel applications and CMOS-based integrated circuits [91]. Taking the advantages of spoof SPP/LSP TLs, passive and active devices, an integration study of SPP/LSP systems is highly demanded to reach new technologies of the wireless communications, radar, and EM compatibility.…”
Section: Discussionmentioning
confidence: 99%
“…Various fully opened spoof SPP TLs have been proposed in literatures 21 – 27 , 34 , 35 . The corrugated ultrathin plasmonic TLs for example, show very good energy confinement and plenty of functional devices based on it have been investigated in the past years.…”
Section: Discussionmentioning
confidence: 99%
“…相对于平行耦合微带线, 两个平行的 SPP 传输线在 220 GHz 到 325 GHz 的宽带范围内具有约 19 dB 的串扰抑制, 初步证明了 SPP 传输线在集成电路中 的优势. 2017 年我们进一步合作将 SPP 传输线应用于片上信道, 并利用开口谐振环进行调制, 验证了 在片上环境下 SPP 传输线仍具有传输串扰低的特性 [89] .…”
Section: 在上述工作的基础上 我们和新加坡南洋理工大学 (Nanyang Technological University) 余浩教授unclassified