1996
DOI: 10.1109/23.556873
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An empirical model for predicting proton induced upset

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Cited by 111 publications
(39 citation statements)
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“…Y is a linear function of energy, which goes to zero when the energy is equal to the critical energy Eo. A variation of this function called the two-parameter Bendel equation [21] is given as: a = (! !...-)*(1_e-OI8F rr (5) Eo…”
Section: Discussionmentioning
confidence: 99%
“…Y is a linear function of energy, which goes to zero when the energy is equal to the critical energy Eo. A variation of this function called the two-parameter Bendel equation [21] is given as: a = (! !...-)*(1_e-OI8F rr (5) Eo…”
Section: Discussionmentioning
confidence: 99%
“…(1) The cross section for a nuclear reaction in Si induced by a 200 MeV proton is approximately s ¼ 0.06 barn [12,13,21,22]; (2) The recoiling heavy ions travel 10 mm in Si or SiO 2 below the active silicon layer [2,12,21]; (3) Considering SOI structure and heavy ions with short track length in metal and insulator layers, we assume that the recoiling heavy ions travel 5 mm in metal and insulator above the active silicon; herein we mainly consider the effect of proton interaction with metal and oxygen with the short track length of 5 mm in metal and insulator layers and in the prediction we will use the proton-silicon nuclear reaction cross section for these layers, which will be addressed in this section. (4) The recoiling heavy ions have an isotropic angular distribution [12,13]; and (5) An upset will take place when a recoiling heavy ion hits the sensitive volume in the memory cell.…”
Section: Proton Induced Seu Cross Section Predictionmentioning
confidence: 99%
“…Among the large number of analytical predictions methods for SEU induced by protons based on heavy ion data, SIMPA [1] and PROFIT [2] are the most widely used by the European space community, as they are included in the OMERE package [3]. These models were developed in the middle of 90s, both require to specify the sensitive thickness and both rely on simplifications which have shown their limits for process technologies below 130 nm (see Table 1).…”
Section: Introductionmentioning
confidence: 99%