An electron-multiplying ‘Micromegas’ grid made in silicon wafer post-processing technology

Chefdeville, M.; Colas, P.; Giomataris, Y.; Graaf, H. van der; Heijne, E.H.M.; Putten, S. van der; Salm, Cora; Schmitz, Jurriaan; Smits, Sander M.; Timmermans, J.; Visschers, J.L.

doi:10.1016/j.nima.2005.11.065

Cited by 75 publications

(41 citation statements)

References 12 publications

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“…By means of wafer post-processing [7] the Micromegas grid can be integrated directly on top of Silicon wafers [8]. With this technology it will be possible to precisely cover CMOS chip wafers with an amplification grid, resulting in a fully integrated readout device for gaseous detector.…”

Section: Ingridmentioning

confidence: 99%

The pixel readout of Micro Patterned Gaseous Detectors

Chefdeville

2007

J. Phys.: Conf. Ser.

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Abstract. The use of pixel readout chips as highly segmented anodes of gaseous detectors offers high granularity and low noise at the input of each channel. This readout can be applied to TPCs for high energy particle tracking as well as for low energy recoil detection where a small charge is created in the gas volume. Detectors combining GEM or Micromegas amplification stages with pixel readout chips will be presented and their tracking capabilities described. IntroductionThe use of pixel readout chips as highly segmented anodes of micro-patterned gaseous detectors offers a few tens of microns granularity and a low noise at the input of each channel allowing the detection in three dimensions of single electrons with a potentially very good spatial resolution, with high rate capability and efficiency.These detectors are well suited for the detection of polarized photons and axions, as both radiations eventually end in a few-keV photo-electron conversion. The photo-electron being absorbed in the gas, its energy can be measured by counting the detected primary electrons; and its track may be resolved thanks to the fine segmentation of the anode. In the same way, the direction and energy of double -ß decay electrons could be measured, as well as the small ionization of low energy nuclear recoils from WIMP or neutrino interactions. This readout can also be applied to TPCs for high energy physic s experiments. In that case, the particle identification (dE/dx) could be improved by counting the primary clusters of electrons along a track and d-rays can be identified and isolated in the analysis. This paper will summarize the progress in Micromegas and GEM based pixelized detectors, describing their combination with the MediPix2 and TimePix pixel readout chips. Meanwhile, emphasis will be put on the on-chip integration of amplification and discharge protection structures.

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Section: Ingridmentioning

confidence: 99%

The pixel readout of Micro Patterned Gaseous Detectors

Chefdeville

2007

J. Phys.: Conf. Ser.

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“…Chefdeville et al [11] demonstrated a Micromegas grid built directly on a silicon wafer, suspended by insulating micropillars obtained by SU-8 photolithography. The fabrication steps used to manufacture this structure are similar to the ones described before for the MGSDs.…”

Section: Micromesh Gaseous Structure Detectorsmentioning

confidence: 99%

SU-8 as a Material for Microfabricated Particle Physics Detectors

Maoddi

Mapelli

Jiguet³

et al. 2014

Micromachines

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Several recent detector technologies developed for particle physics applications are based on microfabricated structures. Detectors built with this approach generally exhibit the overall best performance in terms of spatial and time resolution. Many properties of the SU-8 photoepoxy make it suitable for the manufacturing of microstructured particle detectors. This article aims to review some emerging detector technologies making use of SU-8 microstructuring, namely micropattern gaseous detectors and microfluidic scintillation detectors. The general working principle and main process steps for the fabrication of each device are reported, with a focus on the advantages brought to the device functionality by the use of SU-8. A novel process based on multiple bonding steps for the fabrication of thin multilayer microfluidic scintillation detectors developed by the authors is presented. Finally, a brief overview of the applications for the discussed devices is given.

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“…This combination of Micromegas and ASIC is called InGrid. The mesh is built in a post-processing step similar to the production of bulk-Micromegas and consists of 50 µm high SU8-pillars and a 0.8 µm thick aluminum plane with holes that are aligned with the pixels of the Timepix chip (see figure 8 and references [28] and [29]). …”

Section: Ingridmentioning

confidence: 99%