“…63 Compared to conventional carbon structures with high thermal conductivity, carbon materials with ultralow thermal conductivity are desirable in many thermal management applications where heat transfer needs to be minimized to improve the working performance and reliability of electronic devices without overheating and thermal damages. 64 For the convenience of comparison, we summarize the thermal conductivities of Tri-C 20 and some 3D carbon allotropes, including diamond, 59,60 Bcc-C6, 65 graphite, 57,58 lonsdaleite, 66 etc. with respect to their number of atoms and symmetry group numbers in Fig.…”