An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes

Wu, Je-Yi; Chen, Chih‐Ming; Horng, Ray−Hua; Wuu, Dong−Sing

doi:10.1109/led.2012.2225404

Cited by 9 publications

(1 citation statement)

References 12 publications

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“…The insulation and thermal conductivity of different materials were shown in Table 1. As the thermal conductivity of the insulation layer is much lower than substrate and copper layer, according to Equation (1), enhancing thermal conductivity while maintaining the insulation of the insulation layer has become a key technology in the LED industry [8]. Table 1.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of a Thick Crystalline Al2O3 Coating with Insulation and High Thermal Conductivity via Anodic Oxidation and Subsequent Mic Arc Discharge Treatment

Song

Jiang

2020

Coatings

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Amorphous Al2O3 coating with a thickness of 143 μm was firstly prepared by anodic oxidation, then the amorphous Al2O3 was transformed into crystalline Al2O3 through applying micro arc discharge. The crystal structure of the Al2O3 coatings was analyzed with an X-ray diffractometer. Results indicated that the coating consisted of amorphous and crystalline Al2O3. The microstructure of the coating was characterized by scanning electron microscopy, which showed that the coating had a compact structure. The thermal conductivity of the coating was 23.7 W/m·K, which is significantly higher than that of amorphous Al2O3 coating. The total and specific breakdown voltages of the coating were 3.85 kV and 26.92 kV/mm, which is suitable to apply for high power LED heat sink substrate.

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Section: Introductionmentioning

confidence: 99%