2022
DOI: 10.1039/d2tc01524b
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An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

Abstract: Efficient passive cooling for miniaturized and integrated electronic devices could enhance device reliability with reduced energy consumption. The realization of such technology calls for highly efficient passive heat dissipation materials....

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Cited by 6 publications
(1 citation statement)
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“…
associated with the interfacial thermal transport between graphene layers and water. [6][7][8][9] Generally, the interfacial thermal resistance (ITR) measurements of the solid-liquid interface can be conducted by experimental, theoretical, and computational methods. Although experimental measurements usually face many difficulties, many methods have been developed to detect the ITRs, such as the time-domain thermoreflectance (TDTR) method, the transient hot wire method, the electron-beam (e-beam), and the e-beam method.
…”
mentioning
confidence: 99%
“…
associated with the interfacial thermal transport between graphene layers and water. [6][7][8][9] Generally, the interfacial thermal resistance (ITR) measurements of the solid-liquid interface can be conducted by experimental, theoretical, and computational methods. Although experimental measurements usually face many difficulties, many methods have been developed to detect the ITRs, such as the time-domain thermoreflectance (TDTR) method, the transient hot wire method, the electron-beam (e-beam), and the e-beam method.
…”
mentioning
confidence: 99%