An effective lateral fiber-optic electronic coupling and packaging technique suitable for VHSIC applications

Hartman, Davis H.; Grace, M.I.; Richard, F.

doi:10.1109/jlt.1986.1074630

Cited by 14 publications

(5 citation statements)

References 6 publications

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“…In [48], to achieve TIR (total internal reflection) at a 45 cleaving angle, a reflecting aluminum surface was deposited on a multimode optical fiber and glued to a receiver. Compared with direct coupling, additional coupling losses occurred, attributed mainly to wave spreading, surface roughness, reflectivity of the mirror, and other effects such as misalignment.…”

Section: Optics and Optical Couplingmentioning

confidence: 99%

Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics

Bardalen¹,

Akram²,

Malmbekk³

et al. 2015

Journal of Microelectronics and Electronic Packaging

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In this article, developments and techniques related to optical-fiber-coupled devices operating at cryogenic temperatures are reviewed. These devices include superconducting electronics and photodetectors. Superconducting circuits have a number of suitable characteristics in terms of speed and efficiency, lower power consumption, and traceability to fundamental quantum properties. Thus, applications are found in a number of technologies, such as communication and metrology. Often, the devices are coupled by an optical fiber link to an external source. A suitable design of the optical coupling at cryogenic temperatures entails considerations of electromagnetic behavior, geometry, components, material choices, and customized packaging schemes. Minimizing thermomechanical stresses and deformation is a challenge due to the extreme temperature span, from room temperature to below 10 K. Due to the thermomechanical properties at low temperatures, with high contraction and brittleness of some materials, careful design and testing is dictated for the method of mechanical attachment and alignment techniques to avoid failure. Solutions for the efficient, robust optical coupling remain a challenge for some of these devices.

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Section: Optics and Optical Couplingmentioning

confidence: 99%

Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics

Bardalen¹,

Akram²,

Malmbekk³

et al. 2015

Journal of Microelectronics and Electronic Packaging

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show abstract

“…This is done at a point approximately 300 pm above the chip surface, where both the cladding and the protective jacket of the fiber are still intact. No adhesive is needed at the surface of the chip, as in other fiber-optic coupler designs [4]- [7] because the detector cavity itself prevents any lateral misalignment. The package configuration is stable enough that no fiber has yet pulled out of a detector cavity during testing once it has been bonded to the slide.…”

Section: Device Fabricationmentioning

confidence: 99%

“…A recently reported hybrid approach [6], using silicon V-grooves to guide fibers into an integrated 12 X 1 photodiode array, would place restrictions on detector placement as well as presenting assembly and stability problems typically as- JR., SENIOR MEMBER, IEEE sociated with hybridization. The most technically advanced technique reported to date employs a horizontal fiber terminating in an angled mirrored facet that reflects incoming light down onto the semiconductor substrate [7]. However, use of a multimode fiber requires a large-area detector, and the lateral approach consumes considerable on-chip real estate, limiting the number of fibers that may be coupled to a single IC chip.…”

Section: Introductionmentioning

confidence: 99%

Silicon photodetector structure for direct coupling of optical fibers to integrated circuits

Ade

Harstead

Amirfazli

et al. 1987

IEEE Trans. Electron Devices

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Abstract-A novel detector structure exhibiting real-estate efficient coupling of optical fibers to semiconductor devices is described. The integrated fiber-optic coupler employs vertical insertion of a tapered single-mode fiber into a laser-etched cylindrical hole in the substrate. It features a small surface footprint, mechanical stability, and accurate alignment. Fabricated in silicon, the p-n junction detectors have typically shown responsivities of 0.23 A/W at 0.63 pm, corresponding to a quantum efficiency of 45 percent, and dark currents below 1 uA.

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“…This is accomplished by polishing the exit end of the fiber at an angle to provide total internal reflection of the light that exists through the side of the fiber. 28,29 In this way the fiber axis is parallel to the package substrate. Silicon V-grooves are used to provide the required alignment of the fibers to the detectors.30 -32 The grooves are photolithographically defined and etched using KOH.…”

Section: Detector Alignment and Packagingmentioning

confidence: 99%