2016
DOI: 10.1016/j.commatsci.2015.11.027
|View full text |Cite
|
Sign up to set email alerts
|

An atomistic simulation investigation on chip related phenomena in nanometric cutting of single crystal silicon at elevated temperatures

Abstract: This version is available at https://strathprints.strath.ac.uk/55554/ Strathprints is designed to allow users to access the research output of the University of Strathclyde. Unless otherwise explicitly stated on the manuscript, Copyright © and Moral Rights for the papers on this site are retained by the individual authors and/or other copyright owners. Please check the manuscript for details of any other licences that may have been applied. You may not engage in further distribution of the material for any pro… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

3
25
0

Year Published

2016
2016
2024
2024

Publication Types

Select...
10

Relationship

5
5

Authors

Journals

citations
Cited by 52 publications
(28 citation statements)
references
References 30 publications
3
25
0
Order By: Relevance
“…1, an increase in temperature leads to increased activities of phonons (in crystalline insulators and some semi-conductors), electrons (in metal and some semi-conductors), propagons, diffusons, and locons (in amorphous non-metallic materials), [11,12] which in turn contribute to additional atomic displacements, an increase in the average interatomic distance, and a decrease in the restoring forces due to thermal expansion. [13][14][15][16] While increasing the dislocation mobility, a higher temperature lowers the minimum stresses required for homogeneous dislocation nucleation, dislocation gliding in a lattice, and breaking dislocation locks. As a result, thermal softening improves the plasticity of the material.…”
Section: Nanoscale Deformation Mechanismsmentioning
confidence: 99%
“…1, an increase in temperature leads to increased activities of phonons (in crystalline insulators and some semi-conductors), electrons (in metal and some semi-conductors), propagons, diffusons, and locons (in amorphous non-metallic materials), [11,12] which in turn contribute to additional atomic displacements, an increase in the average interatomic distance, and a decrease in the restoring forces due to thermal expansion. [13][14][15][16] While increasing the dislocation mobility, a higher temperature lowers the minimum stresses required for homogeneous dislocation nucleation, dislocation gliding in a lattice, and breaking dislocation locks. As a result, thermal softening improves the plasticity of the material.…”
Section: Nanoscale Deformation Mechanismsmentioning
confidence: 99%
“…In a preliminary investigation performed in our research group, hot machining of single crystal 3C-SiC at 1200 K was compared with the cutting at 300 K. It was found that hot machining results in lowering tangential cutting forces and thrust forces, yet shear plane angle remained unchanged [2]. In similar work, the authors [3][4][5][6] performed MD simulations to examine the characteristics of hot nanometric cutting of single crystal silicon at various temperatures. It was observed that the anisotropy increases with the increase of cutting temperature.…”
Section: Introductionmentioning
confidence: 99%
“…The micro-/nanoscratching technique can also be adopted to provide extensive insight into the mechanical response and plastic deformation of materials. This method, unlike indentation, is a deviatoric stress-dominative process, carrying a noticeable component of shear, which leads to initiation of multiple plasticity mechanisms which may be different from those during indentation (Ref [5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%