2022
DOI: 10.1109/tmtt.2022.3180332
|View full text |Cite
|
Sign up to set email alerts
|

An Artificial Neural Network Model for Electro-Thermal Effect Affected Hot Carrier Injection Reliability in 14-nm FinFETs

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
21
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 7 publications
(22 citation statements)
references
References 39 publications
0
21
0
Order By: Relevance
“…In order to calculate the HCI-induced threshold voltage shift under stress voltages with different waveforms and frequencies, numerical simulation methods were developed for SOI MOSFETs and FinFETs [26,27,33]. The simulation process can be divided into three parts: (1) the current density can be obtained by numerically solving carrier transport equations, then the time dependent heat generation rate for the device under different stresses voltage can be obtained; (2) by using a numerical method to solve the time-dependent thermal conduction equation, the transient temperature responses can be obtained [26,27,33]; (3) HCI induced threshold voltage shift (TVS) as a function of time is then captured numerically based on the temperature response [26,27,33]. The numerical methods can simulate HCI under various stress voltages and operation conditions.…”
Section: Hci Simulation Via Numerical Methodsmentioning
confidence: 99%
See 4 more Smart Citations
“…In order to calculate the HCI-induced threshold voltage shift under stress voltages with different waveforms and frequencies, numerical simulation methods were developed for SOI MOSFETs and FinFETs [26,27,33]. The simulation process can be divided into three parts: (1) the current density can be obtained by numerically solving carrier transport equations, then the time dependent heat generation rate for the device under different stresses voltage can be obtained; (2) by using a numerical method to solve the time-dependent thermal conduction equation, the transient temperature responses can be obtained [26,27,33]; (3) HCI induced threshold voltage shift (TVS) as a function of time is then captured numerically based on the temperature response [26,27,33]. The numerical methods can simulate HCI under various stress voltages and operation conditions.…”
Section: Hci Simulation Via Numerical Methodsmentioning
confidence: 99%
“…Figure 1a shows the 3D schematics of a 3-Fin 14 nm n-type FinFET, including the source extension, source, channel, drain and drain extension [67,69,70]. The cross sections of the FinFET perpendicular to and parallel to the channel are shown in Figure 1b,c, respectively [33]. The heat generation rate along the channel direction in this FinFET is shown in Figure 2 [33].…”
Section: Electro-thermal Numerical Simulationmentioning
confidence: 99%
See 3 more Smart Citations