An anti-leakage liquid metal thermal interface material

Huang, Kaiyuan; Qiu, Wangkang; Ou, Meilian; Liu, Xiaorui; Liao, Zenan; Chu, Sheng

doi:10.1039/d0ra02351e

Cited by 33 publications

(13 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Such fluidity, however, may lead to leakage problems during operation. [ 6 ] The relatively high surface tension of liquid metal also makes it hard to be uniformly applied on the surface of electronic devices. [ 7 ] Adding solid fillers into the liquid metal matrix via mechanical mixing is an effective way to further increase the thermal conductivity of liquid metal composites while addressing the problem of leakage.…”

Section: Introductionmentioning

confidence: 99%

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

et al. 2021

View full text Add to dashboard Cite

Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1 K−1 is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.

show abstract

Section: Introductionmentioning

confidence: 99%

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

et al. 2021

View full text Add to dashboard Cite

show abstract

“…[ 114 ] Such limitations should be surmounted by surface treatment, encapsulation, elastomer selection, alloying or forming composite, or adhesive glue as well as the development of patterning methods for LM. [ 16,97,108,116,122 ]…”

Section: Perspective and Conclusion On Lm‐based Future Soft Electroni...mentioning

confidence: 99%

Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics

Kim

Lim

2023

Advanced Science

View full text Add to dashboard Cite

Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.

show abstract

“…However, leakage is an issue in practical applications. [13,18,45,51,52] Owing to their high thermal conductivity and dynamic leak-free properties, MILMs are superior to LMs for TIM applications. Thermal resistance is a critical parameter for TIMs; therefore, we compared the thermal resistance of pure EBiInSn and two MILMs under different pressures at ≈70 °C.…”

Section: Performance Displaymentioning

confidence: 99%

“…[42][43][44] Therefore, researchers have considered methods of immobilizing LMs using the device structure or material itself. [45][46] However, although these solutions may work for specific scenarios, they still have some limitations. For example, they complicate device fabrication and cause composition segregation of LMs.…”

mentioning

confidence: 99%

Dynamic Leakage‐Free Liquid Metals

Dong

et al. 2022

Adv Funct Materials

View full text Add to dashboard Cite

show abstract

An anti-leakage liquid metal thermal interface material

Abstract: An improved form of LM/indium film/LM sandwich pad with surface micropillar arrays is a high-performance thermal interface material for thermal management.

Cited by 33 publications

References 26 publications

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics

Dynamic Leakage‐Free Liquid Metals

Contact Info

Product

Resources

About