2009
DOI: 10.1016/j.orgel.2009.03.012
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An analysis of the difference in behavior of top and bottom contact organic thin film transistors using device simulation

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Cited by 152 publications
(83 citation statements)
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“…The standard equations and method of solution for DD models are described in detail by Selberherr [26], and is implemented in many commercial finite-element simulation packages. Such commercial packages are particularly useful to examine complex 2-dimensional device geometries such as OTFTs [96][97][98][99], however, careful consideration and tuning is required to describe charge transport in OSCs rather than inorganic semiconductors [100]. Here we focus on three major considerations when using DD models for OSCs, namely charge generation and recombination, charge transport across a heterojunction, and heterogeneous current flow.…”
Section: 1mentioning
confidence: 99%
“…The standard equations and method of solution for DD models are described in detail by Selberherr [26], and is implemented in many commercial finite-element simulation packages. Such commercial packages are particularly useful to examine complex 2-dimensional device geometries such as OTFTs [96][97][98][99], however, careful consideration and tuning is required to describe charge transport in OSCs rather than inorganic semiconductors [100]. Here we focus on three major considerations when using DD models for OSCs, namely charge generation and recombination, charge transport across a heterojunction, and heterogeneous current flow.…”
Section: 1mentioning
confidence: 99%
“…In OTFTs, there is a common issue of difference in device performance of OTFTs fabricated in top contact and bottom contact device configurations (Gundlach et al, 2006;Gupta et al 2009;Roichman et al, 2002;. The process difference between the two device designs is that in top contact OTFT, semiconductor is deposited prior to depositing source and drain electrodes, while this is vice versa in bottom contact OTFT.…”
Section: Effect Of Device Design Of Otftmentioning
confidence: 99%
“…Pentacene films with thicknesses of 50 nm are deposited by thermal evaporation at the rate of 0.03-0.04 nm/sec at substrate temperature of 65 o C. The channel length (L) for both top and bottom contact devices is 30 μm and their widths (W) are 1mm and 3.6mm, respectively. The experimentally obtained data in the output curves were also corrected in order to remove the effects of gate leakage and contact resistances (Gupta et al, 2009). To correct for the gate leakage, half of the gate current is added to the obtained drain current at each gate voltage.…”
Section: Effect Of Device Design Of Otftmentioning
confidence: 99%
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“…In general, top contact OTFTs have lower contact resistance than bottom contact OTFTs [39]. However, bottom contact OTFTs have better compatibility for large scale integration [40]; therefore, bottom contact OTFT devices with low contact resistance must be developed.…”
Section: Introductionmentioning
confidence: 99%