An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

Abstract

A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copperbased material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

Interface characterization of Cu–Mo coating deposited on Ti–Al alloys by arc spraying

“…A wide range of metals, alloys, and cored wires have been used to fabricate various coatings for different purposes, such as corrosion protection, anti-wear, anti-oxidation, and conductive coatings. [1][2][3][4][5] CoSb 3 -based skutterudite compounds have been regarded as one of the most promising thermoelectric (TE) materials working at an intermediate temperature region due to their special crystal structure and high TE figure of merits (ZT ) in the doped and/or filled p-and n-type materials. The ZT values have reached more than 1.0 in p-type and 1.7 in n-type skutterudites.…”