An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes

Acharya, Sarthak; Chouhan, Shailesh Singh; Delsing, Jerker

doi:10.1109/ectc32862.2020.00206

Cited by 5 publications

(10 citation statements)

References 6 publications

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“…This analysis helps to optimize individual parameters to achieve fine lines on the board. The proposed production technique has great potential in achieving the minimum feature size interconnects on PCB [31].…”

Section: Parameter Optimizationmentioning

confidence: 99%

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Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

2021

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Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique.

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Section: Parameter Optimizationmentioning

confidence: 99%

“…In this work, this technology is adapted with laser activation of surfaces to show its application in PCBs fabrication. In another study [31], this fully additive-selective metallization process was shown on the PCB substrate with smallest feature size possible at the board level.…”

Section: Introductionmentioning

confidence: 99%

Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

2021

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“…The usage of polymeric materials and hybrid (ceramic) substrates in the electronics manufacturing industry has increased in recent years [7,10]. The fabrication process, presented in this paper, comes under non-contact PE technology which uses the LDW technique to make Cu interconnects with polymer-composite-based surface modification [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

“…Concerning the fabrication gaps related to PCBs, those of ICs, a fully additive approach for PCBs has been demonstrated in previous literature [11,13,26]. The objectives of developing such a manufacturing process are to avoid adding extra steps to the process, achieve feature sizes comparable to the ICs, and replace the solder joints with printed electronic metallic interconnects.…”

Section: Introductionmentioning

confidence: 99%

“…The objectives of developing such a manufacturing process are to avoid adding extra steps to the process, achieve feature sizes comparable to the ICs, and replace the solder joints with printed electronic metallic interconnects. So far, a minimum of 2.5 µm feature sizes has been achieved [11]. The replacement of bulky capacitors and inductors with embedded passives was demonstrated using this fabrication technique [13,26].…”

Section: Introductionmentioning

confidence: 99%

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Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)

et al. 2022

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To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work.

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A novel fully additive fabrication approach for creating double-stacked copper spiral inductors

Imani,

Chouhan,

Delsing

2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes

Cited by 5 publications

References 6 publications

Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)

A novel fully additive fabrication approach for creating double-stacked copper spiral inductors

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