2023
DOI: 10.1109/tcsii.2022.3176278
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An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging

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Cited by 1 publication
(2 citation statements)
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“…represents the ratio of the reference electrostatic force to the reference force, in which J is the mechanical tension of d-microplate (Pelesko, 2002;Tilli et al, 2020;Xiao et al, 2022;Yang et al, 2021). Remark 1 Finally, p, locally, provides the influence of the material's permittivity on the device's electromechanical behavior.…”
Section: Galerkin-fem Approachmentioning
confidence: 99%
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“…represents the ratio of the reference electrostatic force to the reference force, in which J is the mechanical tension of d-microplate (Pelesko, 2002;Tilli et al, 2020;Xiao et al, 2022;Yang et al, 2021). Remark 1 Finally, p, locally, provides the influence of the material's permittivity on the device's electromechanical behavior.…”
Section: Galerkin-fem Approachmentioning
confidence: 99%
“…, 2005): and, if γ is a positive dimensionless parameter linked to the stretching effects in the d-microplate, relation (6) can be written as: or, alternatively: in which p is a positive function describing the local dielectric properties of d-microplate (silicon or polysilicon) and: represents the ratio of the reference electrostatic force to the reference force, in which J is the mechanical tension of d-microplate (Pelesko, 2002; Tilli et al. , 2020; Xiao et al. , 2022; Yang et al.…”
Section: The Dynamic Continuous Modelmentioning
confidence: 99%