Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals

Li, C.C.; Shih, Wen-Pin; Chung, Chin‐Lung; Kao, C. R.

doi:10.1016/j.corsci.2014.02.006

Cited by 9 publications

(7 citation statements)

References 17 publications

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“…To overcome this issue, the electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish has been developed. The corrosion of Ni can be greatly eliminated with the insertion of Pd layer [7]. In addition, the introduction of Pd layer can enhance the electromigration (EM) resistance.…”

Section: Introductionmentioning

confidence: 99%

Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

Wang

2015

Intermetallics

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Section: Introductionmentioning

confidence: 99%

Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

Wang

2015

Intermetallics

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“…The final EN layer consisted of 3-9 wt% phosphorous and was between 5 and 9 μm thick. Compositions and preparation conditions of the ENEPIG surface fin 1.50 1.00 0.50 ishes can be found in our previous publication [13]. The surface rough ness of the plated specimens was measured using Atomic Force…”

Section: 50mentioning

confidence: 99%

“…Our study found that flux can further mit igate nano pitting, albeit not entirely. This may be because the immer sion Au and electroless Pd cover the top surface of the nano pitting, acting as an effective barrier of which the flux can clean [13]. As seen in Fig.…”

Section: Evolution Of Nano Pitting During Reflowmentioning

confidence: 99%

“…One of the contributing factors is the inherent porosity found in the immersion Au layer that allows oxygen atoms to diffuse through to the Ni and cause oxidation [12]. As with ENEPIG, introducing an amorphous Pd bar rier layer prevents this diffusion, effectively alleviating the Ni oxidation [13]. However, the nano voids inside the Ni 2 SnP intermetallic are still formed due to a hyperactive corrosion process.…”

Section: Introductionmentioning

confidence: 99%

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Mechanisms and solutions to the brittle solder joint in electroless Ni plating

Wang

Chung

2016

Microelectronics Reliability

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Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in the ENEPIG process remain unclear. In this paper, the inter action between various aspects of the ENEPIG process and solder joint strength were investigated. Surface rough ness, morphology, and nano-pitting at the interface between electroless Pd and NiP were characterized. The size and density of nano voids inside Ni 2 SnP were measured after the specimens were reflowed with Sn4Ag0•5Cu sol der ball. Additionally, high speed shear solder joint strength measurements were made. The results indicated that anion adhesion induced nano-pitting at the interface between the Ni 2 SnP intermetallic and Pd, resulting in the formation of a nano void layer during reflow. These interfacial voids lead to lower solder joint strength. Based on the results, a solution to prevent the brittle solder joint failures is suggested.

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“…They found that as compared with ENIG joints, the grain size of (Cu,Ni,Pd) 6 Sn 5 seemed to be refined by the palladium (Pd) insertion in the ENEPIG joints. This is because Pd would retard the growth of Ni 3 P and (Cu,Ni,Pd) 6 Sn 5 and refine the grain structure of (Cu,Ni,Pd) 6 Sn 5 [20]. The composition of (Cu,Ni,Pd) 6 Sn 5 was evaluated as 35.0 at %Cu,23.2 at%Ni,0.2 at %Pd, and 42.6 at% Sn.…”

Section: Interfacial Reaction Of Solder Alloy and Surface Finishmentioning

confidence: 99%

A review on the effect of surface finish and cooling rate on solder joint reliability

Kahar¹,

Akhtar²,

Idris³

et al. 2016

WIT Transactions on the Built Environment

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With increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders provides an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for the evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic devices' technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using nickel-based surface finish was summarized. The study focused on nickel based surface finish (ENIG and ENEPIG) with different cooling media, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. A faster cooling rate was reported to provide finer IMC grains which might be translated into better solder joint strength. The findings presented here may provide a better understanding for further study and facilitate improvements in terms of solder joint reliability.

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Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals

Cited by 9 publications

References 17 publications

Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

Liquid-state interfacial reactions in Sn–Zn/Pd couples and phase equilibria of the Sn–Zn–Pd system at 260 °C

Mechanisms and solutions to the brittle solder joint in electroless Ni plating

A review on the effect of surface finish and cooling rate on solder joint reliability

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