2015
DOI: 10.1016/j.tsf.2015.07.076
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Amorphous inclusions during Ge and GeSn epitaxial growth via chemical vapor deposition

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Cited by 12 publications
(12 citation statements)
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“…This situation results in weaker and broader averaged signals as compared to the strong sharp peaks expected for ideal perfect materials. Such disorder is especially significant in the localized amorphous Ge 1Àx Sn x regions 27 present in the investigated layers (as confirmed by TEM inspection 27 ). In fact, amorphous regions likely contain several different configurations corresponding to very weak EXAFS signals.…”
Section: -7supporting
confidence: 54%
“…This situation results in weaker and broader averaged signals as compared to the strong sharp peaks expected for ideal perfect materials. Such disorder is especially significant in the localized amorphous Ge 1Àx Sn x regions 27 present in the investigated layers (as confirmed by TEM inspection 27 ). In fact, amorphous regions likely contain several different configurations corresponding to very weak EXAFS signals.…”
Section: -7supporting
confidence: 54%
“…The major challenges towards the fabrication of high-quality strain-free GeSn alloys with high Sn content are attributed to: (i) extremely low equilibrium solubility of α-Sn in Ge (<1%) [16], and as a consequence, a nonequilibrium epitaxy process is required to prevent the Sn segregation and the allotropic phase transition between α-Sn and β-Sn; (ii) due to the 15% lattice mismatch between Ge (6.489 Å) and α-Sn (5.646 Å), the high compressive strains arise during epitaxial growth, making it difficult to grow a relaxed and defect-free thin film of GeSn on Ge-buffered Si wafers; and (iii) low temperature is required for GeSn epitaxy to prevent Sn precipitation, the formation of dislocations and point defects. On the other hand, a low-temperature process leads to the formation of localized or extended amorphous inclusions and a significantly roughened surface [17]. Commonly, the GeSn epitaxial layers are characterized by a high density of misfit dislocations (MDs) at the GeSn/Ge interface [18,19] and Sn segregation at the surface of GeSn films [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…Two commercially available Ge precursors, germane (GeH 4 ) and digermane (Ge 2 H 6 ), are commonly used in (Si)­GeSn chemical vapor deposition (CVD) reactors, while SnCl 4 is the precursor of choice for the Sn atoms. The increased reactivity of Ge 2 H 6 at low growth temperatures and the resulting high growth rates makes it ideal for the epitaxy of thick relaxed layers. , However, Ge 2 H 6 is significantly more expensive than GeH 4 , has limited availability, and the films may be accompanied by the formation of defects. On the other hand, GeH 4 offers lower growth rates and a narrower window of the growth parameters, like the reactor pressure, gas flow rates, and temperature, which offers high crystallinity Sn-rich Ge 1– x Sn x alloys. , It then becomes clear that these parameters have a strong impact on the gas phase reactions of different molecules like GeH 4 and Ge 2 H 6 . The preferred reaction partner for the stable SnCl 4 molecule on the substrate surface are GeH x ( x = 1,2,3) radicals.…”
Section: Introductionmentioning
confidence: 99%