2006
DOI: 10.1016/j.physleta.2005.11.058
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Amorphization of silicon by ion irradiation in dense plasma focus

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Cited by 38 publications
(23 citation statements)
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“…The melt layer is subjected to external forces such as surface tension, gradients of plasma pressure and others. Melt motion driven by external forces produces significant macroscopic erosion of materials [5].…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The melt layer is subjected to external forces such as surface tension, gradients of plasma pressure and others. Melt motion driven by external forces produces significant macroscopic erosion of materials [5].…”
Section: Resultsmentioning
confidence: 99%
“…Plasma focus discharges are known as a remarkable source of hot plasma bunches and fast streams, fast neutrons proceeding from deuterium reactions, hard and soft X-rays, coming from different gases and the anodes in the discharge chamber, and energetic particles such as ions and electrons due to m=0 instabilities which may produce disruptions in plasma column for several nanoseconds. The spatial charge separation as well as the rapid change in the system inductance can generate strong electric fields that accelerate ions toward the top of the chamber and electrons toward the positively charged anode [1][2][3][4][5]. One of the main issues in the field of nuclear fusion research is the engineering design of structural materials.…”
Section: Introductionmentioning
confidence: 99%
“…10) and corresponds to the increase of the short-range order. This result is probably due to the relaxation of amorphous network during which the bond-angle fluctuation decreases [18]. According to [18] a FWHM of ∼ 70 cm −1 corresponds to fully relaxed amorphous silicon with only ∼ 10% distortion of the bond angles.…”
Section: Structure and Microstructure By Raman Scatteringmentioning
confidence: 96%
“…This result is probably due to the relaxation of amorphous network during which the bond-angle fluctuation decreases [18]. According to [18] a FWHM of ∼ 70 cm −1 corresponds to fully relaxed amorphous silicon with only ∼ 10% distortion of the bond angles. Additionally, we observed the shift of the peak position of the TO-like peak atν ∼ 480 cm −1 to higher wavenumbers with increasing the deposition temperature.…”
Section: Structure and Microstructure By Raman Scatteringmentioning
confidence: 96%
“…Another distinct advantage of this technique is that the substrate needs not to be electrically conductive. Thus many of the insulators and semiconductors can be used for surface modification [4][5][6]. This technique, when used for material processing purposes especially in thin film deposition gives the advantages of labour savings, less treatment time, significant reduction in energy consumption over the other methods [7,8].…”
Section: Introductionmentioning
confidence: 99%