2017
DOI: 10.1177/1687814017697628
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Aluminum nitride–filled elastic silicone rubber composites for drag reduction

Abstract: This study presents aluminum nitride/silicone rubber composite as a drag reduction material, inspired by the boundary heating drag reduction mechanism of dolphin skin. Aluminum nitride was added as a thermal conductive filler at weight fractions of 16.67, 21.05, and 28.57 wt% to pristine silicone rubber. Tests of the thermal conductivity and tensile properties showed that the thermal conductivity of all three aluminum nitride/silicone rubber composites were increased 27.9%, 41.4%, and 43.7% than that of the pr… Show more

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Cited by 5 publications
(3 citation statements)
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References 32 publications
(35 reference statements)
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“…Moreover, at measurement temperatures of 45 °C and 55 °C, the enhancement of the thermal conductivity was more than 100%, i.e., 105% and 107%, respectively, as shown in Figure 10a. Our results are comparable to the published results related to the AlN-filled polymer composites, such as AlN-epoxy and AlN-silicone rubber [7,8,10,15,16], but with a much lower volume ratio of the AlN filler in our study. Such differences may come from the smaller dimensions of the AlN particles in current case, i.e., nano versus micro.…”
Section: Resultssupporting
confidence: 91%
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“…Moreover, at measurement temperatures of 45 °C and 55 °C, the enhancement of the thermal conductivity was more than 100%, i.e., 105% and 107%, respectively, as shown in Figure 10a. Our results are comparable to the published results related to the AlN-filled polymer composites, such as AlN-epoxy and AlN-silicone rubber [7,8,10,15,16], but with a much lower volume ratio of the AlN filler in our study. Such differences may come from the smaller dimensions of the AlN particles in current case, i.e., nano versus micro.…”
Section: Resultssupporting
confidence: 91%
“…Large-size fillers (>1 μm) are usually better for thermal conductivity improvement because of their lower interfacial area, which usually behaves as a resistant barrier for thermal conduction [9]. However, large particles will deteriorate the mechanical properties of the composites and tend to introduce more voids in the composite [10,11]. On the other hand, nanofillers will enhance the thermal conductivity considerably at a much lower volume ratio due to the easily formed thermal conduction path, i.e., percolation behavior [12].…”
Section: Introductionmentioning
confidence: 99%
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