2016
DOI: 10.1080/02670844.2015.1121314
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Aluminium and tantalum nitride barriers against copper diffusion in solar absorbers

Abstract: The thermal stability of magnetron sputtered solar absorber coatings was investigated at temperatures of 200-500°C. Diffusion barriers of aluminium (Al) and tantalum nitride (TaN x ) were studied against thermal diffusion of copper substrate atoms. The diffusion barriers studied were experimental DC magnetron sputtered Al and TaN x layers between a copper substrate and an absorber coating. The absorbers were aged by means of heat treatment in air. The influence of diffusion barriers was analysed by optical and… Show more

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Cited by 13 publications
(4 citation statements)
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References 29 publications
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“…The optical images of the bare Cu substrates after heating at 100 • C for 1 h, shown in Figure S1, do not exhibit any changes to film quality. Additionally, it should be noted that Cu was not directly deposited onto Si, but onto an adhesion layer of Al, which has been shown to be effective towards limiting Cu diffusion [60]. The thickness of the Cu film was 400 nm, and even if there was some diffusion of Cu atoms into Si, it is unlikely that this distorted the structure of the SAM, which was not at the Cu/Si interface.…”
Section: Resultsmentioning
confidence: 99%
“…The optical images of the bare Cu substrates after heating at 100 • C for 1 h, shown in Figure S1, do not exhibit any changes to film quality. Additionally, it should be noted that Cu was not directly deposited onto Si, but onto an adhesion layer of Al, which has been shown to be effective towards limiting Cu diffusion [60]. The thickness of the Cu film was 400 nm, and even if there was some diffusion of Cu atoms into Si, it is unlikely that this distorted the structure of the SAM, which was not at the Cu/Si interface.…”
Section: Resultsmentioning
confidence: 99%
“…There are two possible reasons for the changes: crystallization of the Cu thin film, which leads to changes in the optical properties of the Cu thin film, and or diffusion of the Cu atoms as Cu has a very large diffusion coefficient. 31 The depth profiles of O, Si, Ti, N, and Cu elements in the as-deposited and 400 C-annealed SiO 2 -TiN x O y -Cu-Glass SSA obtained from the XPS analysis are shown in Figures 4(a SSA, and the insets are the corresponding AFM images. The AFM images reveal that there is no significant change in the surface morphologies.…”
Section: Resultsmentioning
confidence: 99%
“…Due to its better adhesion to substrates, low-temperature deposition and environmental friendliness, the magnetron sputtering technique has become a new technology for the surface functionalisation of the textiles, which can prepare metal films, metal oxide films, ceramic films, polymer films and nanocomposite films [5][6][7][8][9][10][11][12]. Metallic silver has excellent electrical, optical and chemical properties.…”
Section: Introductionmentioning
confidence: 99%