“…The residual weight of the filler and hybrid filler incorporated epoxy composites was found to be 36%, 45%, 47%, and 49% for the composites containing 40, 60, 60, and 60 wt% of Gr, Gr, Gr/h‐BN, and Gr/Ag, respectively. The high residual mass of the composites might be due to the strong compatibility and interaction of Gr, h‐BN, and Ag with epoxy resin …”
Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.
“…The residual weight of the filler and hybrid filler incorporated epoxy composites was found to be 36%, 45%, 47%, and 49% for the composites containing 40, 60, 60, and 60 wt% of Gr, Gr, Gr/h‐BN, and Gr/Ag, respectively. The high residual mass of the composites might be due to the strong compatibility and interaction of Gr, h‐BN, and Ag with epoxy resin …”
Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.
“…However, the high amount of filler reinforced epoxy composites generally leads poor mechanical properties. [33] Due to this reasons small concentration of fillers (graphene nanoplatelets and alumina) reinforced epoxy matrix to enhance the properties of surface roughness, hardness and friction coefficient.…”
In this work, graphene nanoplatelets have been synthesized using liquid phase exfoliation of graphite flake powder. The exfoliated graphene nanoplatelets were identified and characterized by using UV–Visible–NIR spectroscopy, High resolution transmission electron microscopy, electron diffraction, scanning electron microscopy and X‐ray diffraction. The obtained graphene nanoplatelets and nano alumina at various weight ratios were dispersed in an epoxy matrix to enhance the surface roughness (Ra), micro hardness (Hv) and coefficient of friction (CoF) of epoxy hybrid nanocomposites. The results showed that the Ra and CoF value for the combined loading of 0.2 wt% of graphene nanoplatelets and 0.8 wt% of alumina into the epoxy was decreased to 41.02 and 20.01% whereas, the Hv value was increased to 10.04% when compared with the neat epoxy. The improved mechanical and tribological behaviors are suitable for the applications bearing and coating.
“…In the case of graphene derivatives, the achievement of a proper dispersion is not straightforward due to the strong interactions between graphene sheets, which causes agglomeration in the resin matrix [24]; in consequence, functionalization of the graphene is required with groups such as alkyl silanes. For example, Akhtar et al [25] firstly synthesized a compound formed by alumina and a generic silane; secondly, they followed the same procedure with graphene and, finally, they anchored the two modified molecules. Using trimethoxysilane, Wang et al [4] functionalized graphene to increase thermal stability, storage modulus and glass transition temperature of a polyurethane-acrylate UV-based resin.…”
In this work, a thermoset ultraviolet (UV)-cured polyurethane-acrylate resin was doped with different chemically-modified graphene obtained from a commercial graphene oxide (GO): as-received GO, chemically reduced GO (rGO), GO functionalized with vinyltriethoxysilane (VTES) (GOvtes), and GO functionalized with VTES and subsequently reduced with a chemical agent (rGOvtes). Modified graphene was introduced in the oligomer component via solvent-assisted process using acetone, which was recovered after completion of the process. Results indicate that the GO-doped oligomers produce cured coatings with improved anti-scratch resistance (above the resistance of conventional coatings), without surface defects and high transparency. The anti-scratch resistance was measured with atomic force microscopy (AFM). Additionally, results are presented in terms of Wolf–Wilburn scale, a straightforward method widely accepted and employed in the coating industry.
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